Goldchip technology trademark of Semiconix Corporation for known good die , flip chip , bare die , wafer foundry for discrete semiconductors, , integrated circuits and integrated passive components manufactured by Semiconix Semiconductor,NPN LOW POWER ON SEMICONDUCTOR CROSS REFERENCE, ON Semiconductor,2SC4617-,MSD1819A-RT1-,MSC2712GT1-,MSC2712YT1-,MSD1328-RT1-,MSD1328-ST1-,MSD601-RT1-,MSD601-ST1-,MSD602-RT1-,BC817-16LT1-,BC817-25LT1-,BC817-40LT1-,BC818-40LT1-,BC846ALT1-,BC846BLT1-,BC847ALT1-,BC847BLT1-,BC847CLT1-,BC848ALT1-,BC848BLT1-,BC848CLT1-,BC849BLT1-,BC849CLT1-,BC850BLT1-,BC850CLT1-,BCW32LT1-,BCW33LT1-,BCW65ALT1-,BCW65CLT1-,BCW66GLT1-,BCW72LT1-,BCX19LT1-,MMBT2222ALT1-,MMBT2222LT1-,MMBT2484LT1-,MMBT3416LT3-,MMBT4124LT1-,MMBT4401LT1-,MMBT5088LT1-,MMBT5089LT1-,MMBT5550LT1- NPN LOW POWER ON SEMICONDUCTOR CROSS REFERENCE, ON Semiconductor,2SC4617-,MSD1819A-RT1-,MSC2712GT1-,MSC2712YT1-,MSD1328-RT1-,MSD1328-ST1-,MSD601-RT1-,MSD601-ST1-,MSD602-RT1-,BC817-16LT1-,BC817-25LT1-,BC817-40LT1-,BC818-40LT1-,BC846ALT1-,BC846BLT1-,BC847ALT1-,BC847BLT1-,BC847CLT1-,BC848ALT1-,BC848BLT1-,BC848CLT1-,BC849BLT1-,BC849CLT1-,BC850BLT1-,BC850CLT1-,BCW32LT1-,BCW33LT1-,BCW65ALT1-,BCW65CLT1-,BCW66GLT1-,BCW72LT1-,BCX19LT1-,MMBT2222ALT1-,MMBT2222LT1-,MMBT2484LT1-,MMBT3416LT3-,MMBT4124LT1-,MMBT4401LT1-,MMBT5088LT1-,MMBT5089LT1-,MMBT5550LT1- NPN LOW POWER ON SEMICONDUCTOR CROSS REFERENCE, ON Semiconductor,2SC4617-,MSD1819A-RT1-,MSC2712GT1-,MSC2712YT1-,MSD1328-RT1-,MSD1328-ST1-,MSD601-RT1-,MSD601-ST1-,MSD602-RT1-,BC817-16LT1-,BC817-25LT1-,BC817-40LT1-,BC818-40LT1-,BC846ALT1-,BC846BLT1-,BC847ALT1-,BC847BLT1-,BC847CLT1-,BC848ALT1-,BC848BLT1-,BC848CLT1-,BC849BLT1-,BC849CLT1-,BC850BLT1-,BC850CLT1-,BCW32LT1-,BCW33LT1-,BCW65ALT1-,BCW65CLT1-,BCW66GLT1-,BCW72LT1-,BCX19LT1-,MMBT2222ALT1-,MMBT2222LT1-,MMBT2484LT1-,MMBT3416LT3-,MMBT4124LT1-,MMBT4401LT1-,MMBT5088LT1-,MMBT5089LT1-,MMBT5550LT1- Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.

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	NPN_LOW_POWER ON SEMICONDUCTOR CROSS REFERENCE

GOLD CHIP TECHNOLOGY™

125mW → 150mW → 200mW → 225mW → 260mW → 310mW → 350mW → 535mW → 625mW → 1000mW → 1500mW → ON SEMICONDUCTOR 125mW npn low power 2SC4617 SMX2SC4617 BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 150mW npn low power MSD1819A-RT1 SMXMSD1819A-RT1 BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 200mW npn low power MSC2712GT1 SMXMSC2712GT1 BARE DIE FLIP CHIP nDFN MSD601-ST1 SMXMSD601-ST1 BARE DIE FLIP CHIP nDFN MSC2712YT1 SMXMSC2712YT1 BARE DIE FLIP CHIP nDFN MSD602-RT1 SMXMSD602-RT1 BARE DIE FLIP CHIP nDFN MSD1328-RT1 SMXMSD1328-RT1 BARE DIE FLIP CHIP nDFN MSD1328-ST1 SMXMSD1328-ST1 BARE DIE FLIP CHIP nDFN MSD601-RT1 SMXMSD601-RT1 BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 225mW npn low power BC817-16LT1 SMXBC817-16LT1 BARE DIE FLIP CHIP nDFN BCX19LT1 SMXBCX19LT1 BARE DIE FLIP CHIP nDFN BC817-25LT1 SMXBC817-25LT1 BARE DIE FLIP CHIP nDFN MMBT2222ALT1 SMXMMBT2222ALT1 BARE DIE FLIP CHIP nDFN BC817-40LT1 SMXBC817-40LT1 BARE DIE FLIP CHIP nDFN MMBT2222LT1 SMXMMBT2222LT1 BARE DIE FLIP CHIP nDFN BC818-40LT1 SMXBC818-40LT1 BARE DIE FLIP CHIP nDFN MMBT2484LT1 SMXMMBT2484LT1 BARE DIE FLIP CHIP nDFN BC846ALT1 SMXBC846ALT1 BARE DIE FLIP CHIP nDFN MMBT3416LT3 SMXMMBT3416LT3 BARE DIE FLIP CHIP nDFN BC846BLT1 SMXBC846BLT1 BARE DIE FLIP CHIP nDFN MMBT4124LT1 SMXMMBT4124LT1 BARE DIE FLIP CHIP nDFN BC847ALT1 SMXBC847ALT1 BARE DIE FLIP CHIP nDFN MMBT4401LT1 SMXMMBT4401LT1 BARE DIE FLIP CHIP nDFN BC847BLT1 SMXBC847BLT1 BARE DIE FLIP CHIP nDFN MMBT5088LT1 SMXMMBT5088LT1 BARE DIE FLIP CHIP nDFN BC847CLT1 SMXBC847CLT1 BARE DIE FLIP CHIP nDFN MMBT5089LT1 SMXMMBT5089LT1 BARE DIE FLIP CHIP nDFN BC848ALT1 SMXBC848ALT1 BARE DIE FLIP CHIP nDFN MMBT5550LT1 SMXMMBT5550LT1 BARE DIE FLIP CHIP nDFN BC848BLT1 SMXBC848BLT1 BARE DIE FLIP CHIP nDFN MMBT5551LT1 SMXMMBT5551LT1 BARE DIE FLIP CHIP nDFN BC848CLT1 SMXBC848CLT1 BARE DIE FLIP CHIP nDFN MMBT6428LT1 SMXMMBT6428LT1 BARE DIE FLIP CHIP nDFN BC849BLT1 SMXBC849BLT1 BARE DIE FLIP CHIP nDFN MMBT6429LT1 SMXMMBT6429LT1 BARE DIE FLIP CHIP nDFN BC849CLT1 SMXBC849CLT1 BARE DIE FLIP CHIP nDFN MMBT6517LT1 SMXMMBT6517LT1 BARE DIE FLIP CHIP nDFN BC850BLT1 SMXBC850BLT1 BARE DIE FLIP CHIP nDFN MMBT6521LT1 SMXMMBT6521LT1 BARE DIE FLIP CHIP nDFN BC850CLT1 SMXBC850CLT1 BARE DIE FLIP CHIP nDFN MMBT8099LT1 SMXMMBT8099LT1 BARE DIE FLIP CHIP nDFN BCW32LT1 SMXBCW32LT1 BARE DIE FLIP CHIP nDFN MMBTA05LT1 SMXMMBTA05LT1 BARE DIE FLIP CHIP nDFN BCW33LT1 SMXBCW33LT1 BARE DIE FLIP CHIP nDFN MMBTA06LT1 SMXMMBTA06LT1 BARE DIE FLIP CHIP nDFN BCW65ALT1 SMXBCW65ALT1 BARE DIE FLIP CHIP nDFN MMBTA42LT1 SMXMMBTA42LT1 BARE DIE FLIP CHIP nDFN BCW65CLT1 SMXBCW65CLT1 BARE DIE FLIP CHIP nDFN MMBTA43LT1 SMXMMBTA43LT1 BARE DIE FLIP CHIP nDFN BCW66GLT1 SMXBCW66GLT1 BARE DIE FLIP CHIP nDFN BCW72LT1 SMXBCW72LT1 BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 260mW npn low power 2SC5658M3T5G SMX2SC5658M3T5G BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 310mW npn low power MMBT489LT1 SMXMMBT489LT1 BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 350mW npn low power BC182B SMXBC182B BARE DIE FLIP CHIP nDFN BC237B SMXBC237B BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 535mW npn low power NST489AMT1 SMXNST489AMT1 BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 625mW npn low power BC337-25 SMXBC337-25 BARE DIE FLIP CHIP nDFN BC639-16 SMXBC639-16 BARE DIE FLIP CHIP nDFN BC337-40 SMXBC337-40 BARE DIE FLIP CHIP nDFN MPS2222 SMXMPS2222 BARE DIE FLIP CHIP nDFN BC546B SMXBC546B BARE DIE FLIP CHIP nDFN MPS2222A SMXMPS2222A BARE DIE FLIP CHIP nDFN BC547A SMXBC547A BARE DIE FLIP CHIP nDFN MPS4124 SMXMPS4124 BARE DIE FLIP CHIP nDFN BC547B SMXBC547B BARE DIE FLIP CHIP nDFN MPS5172 SMXMPS5172 BARE DIE FLIP CHIP nDFN BC547C SMXBC547C BARE DIE FLIP CHIP nDFN MPS650 SMXMPS650 BARE DIE FLIP CHIP nDFN BC548B SMXBC548B BARE DIE FLIP CHIP nDFN MPS6601 SMXMPS6601 BARE DIE FLIP CHIP nDFN BC548C SMXBC548C BARE DIE FLIP CHIP nDFN MPSA20 SMXMPSA20 BARE DIE FLIP CHIP nDFN BC549B SMXBC549B BARE DIE FLIP CHIP nDFN P2N2222A SMXP2N2222A BARE DIE FLIP CHIP nDFN BC549C SMXBC549C BARE DIE FLIP CHIP nDFN BC550B SMXBC550B BARE DIE FLIP CHIP nDFN BC550C SMXBC550C BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 1000mW npn low power MPS6717 SMXMPS6717 BARE DIE FLIP CHIP nDFN MPSW01A SMXMPSW01A BARE DIE FLIP CHIP nDFN ON SEMICONDUCTOR 1500mW npn low power PZT2222AT1 SMXPZT2222AT1 BARE DIE FLIP CHIP nDFN PZT3904T1 SMXPZT3904T1 BARE DIE FLIP CHIP nDFN PZTA42T1 SMXPZTA42T1 BARE DIE FLIP CHIP nDFN

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