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Semiconix has undertaken the task to redesign and manufacture the future semiconductor components compatible with chip and wire, flip chip,
chip scale CSP and surface mount technologies. In today's extreme miniaturization market, there is no more room for the large packages to
protect the die. It means that the bare die has to withstand harsh environmental conditions without the protection of a package. Known Good
Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. The solution developed by
Semiconix for known good die for bare die applications is GOLD CHIP
TECHNOLOGY™, i.e. gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix
designs and manufactures standard and custom semiconductor components for medical, wireless telecommunications, opto-electronics, computing,
military and space applications.
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