Low Drop Voltage Regulators: SMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3101M1-ADJ SOT23-5L AMS Advanced Monolithic Systems AMS3101M1-ADJ manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3101M1-ADJ SOT23-5L AMS Advanced Monolithic Systems AMS3101M1-ADJ manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT23-5L AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ,SMS3101M1-ADJ,150mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Low Drop Voltage Regulators: SMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3101M1-ADJ SOT23-5L AMS Advanced Monolithic Systems AMS3101M1-ADJ manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS3101M1-ADJ SOT23-5L AMS Advanced Monolithic Systems AMS3101M1-ADJ manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT23-5L AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ,SMS3101M1-ADJ,150mA Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS3101M1-ADJ - FLIP CHIP GOLD CHIP TECHNOLOGY™ 150mA LOW DROPOUT VOLTAGE REGULATOR FEATURES APPLICATIONS 150mA Low Drop Voltage Regulators - FLIP CHIP 0.6V to 6V in 100mV increments Voltages Available Active High On/Off Control Output Current of 150mA Quiescent Current of <1μA when in Shutdown Low Dropout Voltage of 250mV at 150mA Wide Supply Voltage Range 1.5V to 15V Short Circuit and Thermal Protection Power Good function option Ceramic Output Capacitor OK Reference bypass for lower noise High reliability Unique new design in 1206 style case Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Battery Powered Systems Cellular Phones Cordless Telephones Portable (Notebook) Computers Portable Instrumentation Portable Consumer Equipment Personal Communication Equipment Radio Control Systems Low Voltage Systems MP3 Player Chip on Board System in package SIP Hybrid Circuits SMS3101M1-ADJ AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR 150mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION SMS3101 series are 150mA low dropout fixed voltage regulators, featuring an internal electronic switch controlled by TTL or CMOS logic levels. When the Enable pin is pulled to a logic high level, the device is in the ON state. Designed specifically for battery powered applications where low quiescent current, low dropout and low standby current are required, the SMS3101 is ideal to use in standby power systems. Like other regulators the SMS3101 series also includes internal current limiting and thermal shutdown. A high precision 0.6V voltage reference enables the device to provide very low output voltages. A key feature includes a reference bypass pin to improve its low-noise performance for fixed output versions. Ideal for space critical applications, the SMS3101 is available in the 5-pin SOT-23 surface mount package and requires only a 10ïF capacitor on the output for a minimum amount of external components. The Power Good option is used when the Output Voltage drop must be detected. If the Output Voltage drops by approximately 15% of its nominal value, the open collector on PG pin will pull down to Low state. Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally limited Input Voltage 16 V Operating Voltage Range 40 V Storage Temperature -65 to +150 °C Operating Junction Temperature -40 to +125 °C Electrical Characteristics at VIN=VOUT +1V, IO=1mA, CIN=10µF, COUT=22µF, VON/OFF=2V unless otherwise specified. Name Symbol Test Conditions Value Unit Min. Typ. Max Reference Voltage Adjustable device option 0.488 0.6 0.612 V Output Voltage 1mA≤IO≤150 mA -2 2 % Output Voltage, over the full operating temperature range. 1mA≤IO≤150 mA -3.5 3.5 % Line Regulation VOUT+1V≤VIN≤15V 0.6 1 mV/V Line Regulation, over the full operating temperature range. VOUT+1V≤VIN≤15V 2 mV/V Load Regulation IL=0.1mA to 150mA 0.1 0.4 mV/mA Load Regulation, over the full operating temperature range. IL=0.1mA to 150mA 0.8 mV/mA Ground Pin Current IO=0 mA 70 100 m A Ground Pin Current IO=150 mA 1.2 1.5 mA Quiescent Current VEN≤0.9V (shutdown) 0.01 1 m A Quiescent Current VEN≤0.8V (shutdown) 5 m A Ripple Rejection f=1kHz, COUT=10µF 75 dB Output Noise Voltage 300Hz to 50KHz,Co=10µF 60 m V Short Circuit Current RL=0Ω 140 mA On/Off Current VON/OFF=0V 0 -1 µ A On/Off Current VON/OFF=5V 5 15 µ A On/Off Voltage High=Output On 1.3 1.25 V On/Off Voltage Low=Output Off 0.9 V Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables.. Note 2: The ON/OFF inputs must be properly driven to prevent possible misoperation. Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in normal type apply for TA = TJ = 25°C. SPICE MODEL AMS3101M1-ADJ spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS3101M1-ADJ GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon Si 10±2 73.6x56.7±1 [1.87x1.44±0.025] Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR SMS3101M1-ADJ AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR wire bonding SMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATORthermosonic SMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATORthermal SMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATORsolder reflow SMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR APPLICATION HINTS Pin description Enable - active high, switch the device inON state. BP - Reference bypass pin for lower noise. PG - Power Good Open Collector pin, active low when Output Voltage drops by approximately 15% of its nominal value. SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMS3101M1-ADJ-FC -WP 1000 -FF 1000 Flip chip SMS3101M1-ADJ-FC -WP 5000 -FF 5000 Gold Bump SMS3101M1-ADJ-GB -WP 1000 -FF 1000 Gold Bump SMS3101M1-ADJ-GB -WP 5000 -FF 5000 Gold-Tin SMS3101M1-ADJ-GT -WP 1000 -FF 1000 Gold-Tin SMS3101M1-ADJ-GT -WP 5000 -FF 5000 Gold/Nickel SMS3101M1-ADJ-AN -WP 1000 -FF 1000 Gold/Nickel SMS3101M1-ADJ-AN -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMS3101M1-ADJ - FLIP CHIP
GOLD CHIP TECHNOLOGY™ 150mA LOW DROPOUT VOLTAGE REGULATOR

FEATURES APPLICATIONS 150mA Low Drop Voltage Regulators - FLIP CHIP
0.6V to 6V in 100mV increments Voltages Available
Active High On/Off Control
Output Current of 150mA
Quiescent Current of <1μA when in Shutdown
Low Dropout Voltage of 250mV at 150mA
Wide Supply Voltage Range 1.5V to 15V
Short Circuit and Thermal Protection
Power Good function option
Ceramic Output Capacitor OK
Reference bypass for lower noise
High reliability
Unique new design in 1206 style case
Gold metallization
RoHS compliant, Lead Free
Compatible with both chip and wire, flip chip and surface mount assembly.
Battery Powered Systems
Cellular Phones
Cordless Telephones
Portable (Notebook) Computers
Portable Instrumentation
Portable Consumer Equipment
Personal Communication Equipment
Radio Control Systems
Low Voltage Systems
MP3 Player
Chip on Board
System in package SIP
Hybrid Circuits
SMS3101M1-ADJ AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR

150mA LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION
SMS3101 series are 150mA low dropout fixed voltage regulators, featuring an internal electronic switch controlled by TTL or CMOS logic levels. When the Enable pin is pulled to a logic high level, the device is in the ON state. Designed specifically for battery powered applications where low quiescent current, low dropout and low standby current are required, the SMS3101 is ideal to use in standby power systems. Like other regulators the SMS3101 series also includes internal current limiting and thermal shutdown. A high precision 0.6V voltage reference enables the device to provide very low output voltages. A key feature includes a reference bypass pin to improve its low-noise performance for fixed output versions. Ideal for space critical applications, the SMS3101 is available in the 5-pin SOT-23 surface mount package and requires only a 10F capacitor on the output for a minimum amount of external components. The Power Good option is used when the Output Voltage drop must be detected. If the Output Voltage drops by approximately 15% of its nominal value, the open collector on PG pin will pull down to Low state.
Flip Chip Low Drop Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally limited
Input Voltage 16 V
Operating Voltage Range 40 V
Storage Temperature -65 to +150 °C
Operating Junction Temperature -40 to +125 °C

Electrical Characteristics at VIN=VOUT +1V, IO=1mA, CIN=10µF, COUT=22µF, VON/OFF=2V unless otherwise specified.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Reference Voltage Adjustable device option 0.488 0.6 0.612 V
Output Voltage 1mA≤IO≤150 mA -2 2 %
Output Voltage, over the full operating temperature range. 1mA≤IO≤150 mA -3.5 3.5 %
Line Regulation VOUT+1V≤VIN≤15V 0.6 1 mV/V
Line Regulation, over the full operating temperature range. VOUT+1V≤VIN≤15V 2 mV/V
Load Regulation IL=0.1mA to 150mA 0.1 0.4 mV/mA
Load Regulation, over the full operating temperature range. IL=0.1mA to 150mA 0.8 mV/mA
Ground Pin Current IO=0 mA 70 100 m A
Ground Pin Current IO=150 mA 1.2 1.5 mA
Quiescent Current VEN≤0.9V (shutdown) 0.01 1 m A
Quiescent Current VEN≤0.8V (shutdown) 5 m A
Ripple Rejection f=1kHz, COUT=10µF 75 dB
Output Noise Voltage 300Hz to 50KHz,Co=10µF 60 m V
Short Circuit Current RL=0Ω 140 mA
On/Off Current VON/OFF=0V 0 -1 µ A
On/Off Current VON/OFF=5V 5 15 µ A
On/Off Voltage High=Output On 1.3 1.25 V
On/Off Voltage Low=Output Off 0.9 V
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. For guaranteed performance limits and associated test
conditions, see the Electrical Characteristics tables..
Note 2: The ON/OFF inputs must be properly driven to prevent possible misoperation.
Note 3: Limits appearing in boldface type apply over the entire junction temperature range for operation. Limits appearing in
normal type apply for TA = TJ = 25°C.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS3101M1-ADJ

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Size
LxW[mils]
Bonding pads dimensions per drawing Backside
Silicon
Si
10±2 73.6x56.7±1
[1.87x1.44±0.025]
TypePad metalThicknessAssembly
-FCTiW/Au4µm±1Wire bonding or Silver epoxy
-GBTiW/Au25µm±2.5Thermosonic
-GTTi/Pt/AuSn5µm±1Reflow
-ANNi/Au5µm±1Solder reflow
Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
Click to select process: -FC -GB -GT -AN
SMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR SMS3101M1-ADJ AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR
wire bonding SMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ AMS Advanced Monolithic Systems AMS3101M1-ADJ 150mA LOW DROPOUT VOLTAGE REGULATOR

APPLICATION HINTS

Pin description


Enable - active high, switch the device inON state.
BP - Reference bypass pin for lower noise.
PG - Power Good Open Collector pin, active low when Output Voltage drops by approximately 15% of its nominal value.




SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process.
Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications.
Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc.
Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
Flip chip SMS3101M1-ADJ-FC -WP 1000 -FF 1000
Flip chip SMS3101M1-ADJ-FC -WP 5000 -FF 5000
Gold Bump SMS3101M1-ADJ-GB -WP 1000 -FF 1000
Gold Bump SMS3101M1-ADJ-GB -WP 5000 -FF 5000
Gold-Tin SMS3101M1-ADJ-GT -WP 1000 -FF 1000
Gold-Tin SMS3101M1-ADJ-GT -WP 5000 -FF 5000
Gold/Nickel SMS3101M1-ADJ-AN -WP 1000 -FF 1000
Gold/Nickel SMS3101M1-ADJ-AN -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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