Goldchip technology trademark of Semiconix Corporation for known good die , flip chip , bare die , wafer foundry for discrete semiconductors, , integrated circuits and integrated passive components manufactured by Semiconix Semiconductor,RECTIFIER DIODES DIODES INC. CROSS REFERENCE, Diodes Inc.,1N5711-,1N5711W-,1N6263-,BAS40-,BAS40BRW-,BAS40DW-,BAS40T-,BAS40TW-,BAS70-,BAS70BRW-,BAS70DW-,BAS70TW-,BAT40-,BAT42-,BAT46-,BAT54-,BAT54ADW-,BAT54BRW-,BAT54CDW-,BAT54SDW-,BAT54W-,PD3S0230-,QSBT40-,SD101A-,SD101B-,SD101C-,SD103A-,SD103B-,SD103C-,SD107WS-,SDM03MT40-,SDM03U40-,SDM10K45-,SDM10M45SD-,SDM20E40C-,SDM20N40A-,SDM20U30-,SDM20U30LP-,SDM20U40-,SDM40E20LS-,SDM6CC-,SDMG0340L-,SDMP0340LT- RECTIFIER DIODES DIODES INC. CROSS REFERENCE, Diodes Inc.,1N5711-,1N5711W-,1N6263-,BAS40-,BAS40BRW-,BAS40DW-,BAS40T-,BAS40TW-,BAS70-,BAS70BRW-,BAS70DW-,BAS70TW-,BAT40-,BAT42-,BAT46-,BAT54-,BAT54ADW-,BAT54BRW-,BAT54CDW-,BAT54SDW-,BAT54W-,PD3S0230-,QSBT40-,SD101A-,SD101B-,SD101C-,SD103A-,SD103B-,SD103C-,SD107WS-,SDM03MT40-,SDM03U40-,SDM10K45-,SDM10M45SD-,SDM20E40C-,SDM20N40A-,SDM20U30-,SDM20U30LP-,SDM20U40-,SDM40E20LS-,SDM6CC-,SDMG0340L-,SDMP0340LT- RECTIFIER DIODES DIODES INC. CROSS REFERENCE, Diodes Inc.,1N5711-,1N5711W-,1N6263-,BAS40-,BAS40BRW-,BAS40DW-,BAS40T-,BAS40TW-,BAS70-,BAS70BRW-,BAS70DW-,BAS70TW-,BAT40-,BAT42-,BAT46-,BAT54-,BAT54ADW-,BAT54BRW-,BAT54CDW-,BAT54SDW-,BAT54W-,PD3S0230-,QSBT40-,SD101A-,SD101B-,SD101C-,SD103A-,SD103B-,SD103C-,SD107WS-,SDM03MT40-,SDM03U40-,SDM10K45-,SDM10M45SD-,SDM20E40C-,SDM20N40A-,SDM20U30-,SDM20U30LP-,SDM20U40-,SDM40E20LS-,SDM6CC-,SDMG0340L-,SDMP0340LT- Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.
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DIODES INC. 1A rectifier diodes
1N5711SMXDS70V0A015BARE DIEFLIP CHIPnDFN SD101ASMXDS60V0A015BARE DIEFLIP CHIPnDFN
1N5711WSMXDS70V0A015BARE DIEFLIP CHIPnDFN SD101BSMXDS50V0A015BARE DIEFLIP CHIPnDFN
1N6263SMXDS60V0A015BARE DIEFLIP CHIPnDFN SD101CSMXDS40V0A015BARE DIEFLIP CHIPnDFN
BAS40SMXDS40V0A200BARE DIEFLIP CHIPnDFN SD103ASMXDS40V0A350BARE DIEFLIP CHIPnDFN
BAS40BRWSMXDS40V0A200BARE DIEFLIP CHIPnDFN SD103BSMXDS30V0A350BARE DIEFLIP CHIPnDFN
BAS40DWSMXDS40V0A200BARE DIEFLIP CHIPnDFN SD103CSMXDS20V0A350BARE DIEFLIP CHIPnDFN
BAS40TSMXDS40V0A200BARE DIEFLIP CHIPnDFN SD107WSSMXDS30V0A100BARE DIEFLIP CHIPnDFN
BAS40TWSMXDS40V0A200BARE DIEFLIP CHIPnDFN SDM03MT40SMXDS30V0A030BARE DIEFLIP CHIPnDFN
BAS70SMXDS70V0A200BARE DIEFLIP CHIPnDFN SDM03U40SMXDS30V0A030BARE DIEFLIP CHIPnDFN
BAS70BRWSMXDS70V0A070BARE DIEFLIP CHIPnDFN SDM10K45SMXDS45V0A100BARE DIEFLIP CHIPnDFN
BAS70DWSMXDS70V0A070BARE DIEFLIP CHIPnDFN SDM10M45SDSMXDS45V0A100BARE DIEFLIP CHIPnDFN
BAS70TWSMXDS70V0A070BARE DIEFLIP CHIPnDFN SDM20E40CSMXDS40V0A400BARE DIEFLIP CHIPnDFN
BAT40SMXDS40V0A350BARE DIEFLIP CHIPnDFN SDM20N40ASMXDS40V0A200BARE DIEFLIP CHIPnDFN
BAT42SMXDS30V0A200BARE DIEFLIP CHIPnDFN SDM20U30SMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAT46SMXDS100V0A150BARE DIEFLIP CHIPnDFN SDM20U30LPSMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAT54SMXDS30V0A200BARE DIEFLIP CHIPnDFN SDM20U40SMXDS40V0A250BARE DIEFLIP CHIPnDFN
BAT54ADWSMXDS30V0A200BARE DIEFLIP CHIPnDFN SDM40E20LSSMXDS20V0A400BARE DIEFLIP CHIPnDFN
BAT54BRWSMXDS30V0A200BARE DIEFLIP CHIPnDFN SDM6CCSMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAT54CDWSMXDS30V0A200BARE DIEFLIP CHIPnDFN SDMG0340LSMXDS30V0A030BARE DIEFLIP CHIPnDFN
BAT54SDWSMXDS30V0A200BARE DIEFLIP CHIPnDFN SDMP0340LTSMXDS30V0A030BARE DIEFLIP CHIPnDFN
BAT54WSMXDS30V0A200BARE DIEFLIP CHIPnDFN
PD3S0230SMXDS30V0A200BARE DIEFLIP CHIPnDFN
QSBT40SMXDS30V0A200BARE DIEFLIP CHIPnDFN

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