Goldchip technology trademark of Semiconix Corporation for known good die , flip chip , bare die , wafer foundry for discrete semiconductors, , integrated circuits and integrated passive components manufactured by Semiconix Semiconductor,RECTIFIER DIODES INFINEON CROSS REFERENCE, Infineon,BAT60A-,BAT60B-,BAS140W-,BAS170W-,BAS3005A-02V-,BAS3005B-02V-,BAS3010A-03W-,BAS3010B-03W-,BAS40-,BAS40-02L-,BAS52-02V-,BAS70-,BAS70-02L-,BAS70-02W-,BAS70-04S-,BAT15-02LRH-,BAT15-03W-,BAT15-07LRH-,BAT15-099-,BAT165-,BAT17-,BAT24-02LS-,BAT240A-,BAT54-,BAT54-02LRH-,BAT54-06-,BAT54-06W-,BAT54W-,BAT62-02L-,BAT62-02LS-,BAT62-02W-,BAT62-03W-,BAT63-02V-,BAT64-,BAT64-02W-,BAT64-04T-,BAT68- RECTIFIER DIODES INFINEON CROSS REFERENCE, Infineon,BAT60A-,BAT60B-,BAS140W-,BAS170W-,BAS3005A-02V-,BAS3005B-02V-,BAS3010A-03W-,BAS3010B-03W-,BAS40-,BAS40-02L-,BAS52-02V-,BAS70-,BAS70-02L-,BAS70-02W-,BAS70-04S-,BAT15-02LRH-,BAT15-03W-,BAT15-07LRH-,BAT15-099-,BAT165-,BAT17-,BAT24-02LS-,BAT240A-,BAT54-,BAT54-02LRH-,BAT54-06-,BAT54-06W-,BAT54W-,BAT62-02L-,BAT62-02LS-,BAT62-02W-,BAT62-03W-,BAT63-02V-,BAT64-,BAT64-02W-,BAT64-04T-,BAT68- RECTIFIER DIODES INFINEON CROSS REFERENCE, Infineon,BAT60A-,BAT60B-,BAS140W-,BAS170W-,BAS3005A-02V-,BAS3005B-02V-,BAS3010A-03W-,BAS3010B-03W-,BAS40-,BAS40-02L-,BAS52-02V-,BAS70-,BAS70-02L-,BAS70-02W-,BAS70-04S-,BAT15-02LRH-,BAT15-03W-,BAT15-07LRH-,BAT15-099-,BAT165-,BAT17-,BAT24-02LS-,BAT240A-,BAT54-,BAT54-02LRH-,BAT54-06-,BAT54-06W-,BAT54W-,BAT62-02L-,BAT62-02LS-,BAT62-02W-,BAT62-03W-,BAT63-02V-,BAT64-,BAT64-02W-,BAT64-04T-,BAT68- Semiconix Semiconductor designs and manufactures analog devices built on semiconductor linear technology. Semiconix Semiconductor Designs and manufactures standard and custom bipolar and MOS analog devices, semiconductors, analog integrated circuits, discrete components for high performance systems such as cellular/wireless, video amplifiers, heart pacemakers and medical imaging systems. Standard semiconductor components are designed and manufactured for space, medical, telecommunications and military applications only. Company's technology road map is including SiGe epi devices for high speed RF bipolars and high speed fiber optic and optoelectronic applications. Analog devices, ASIC analog design and manufacturing: Semiconix produces a series of semi-custom bipolar analog devices in arrays that are customized by designing a specific metal interconnection mask. The arrays contain a large number of undedicated active and passive components, i.e. transistors, diodes, resistors, capacitors, MOSFET s, LDMOS, photodiodes, phototransistors, etc. Since wafers are stocked before the metal mask, the custom IC development phase is shorter and far less expensive compared to conventional full custom ICs. Customers may provide own analog design. Optoelectronic components: photodiodes, photodiodes arrays, phototransistors, position sensing devices, optocouplers, optoisolators, photodarlington, high voltage phototransistors output, Schottky infrared detectors. Discrete semiconductors: Schottky diodes, Zenner diodes, TVS, small signal bipolar transistors, high voltage bipolar transistors, matched pair bipolar transistors, small signal JFET s and MOSFET s, MCT (MOS controlled tyristors), IGBT. Semiconix 's Divisions: HTE Labs Provides Wafer Foundry, R&D support and Specialty Wafer Fab Processing (including thin film vacuum deposition services) to customers from semiconductors and microelectronics industry. Wafer foundry includes the following processes: 20V, 45V, 75V, 25V super-beta and high voltage dielectric isolated bipolar process. R&D support is provided in the following fields of microelectronics: thin film active and passive components technologies, flip chip technology (TiW/Cu/Cu/SnPb), sensor technologies (inertial, pressure, temperature, gas and smoke detectors), optoelectronic technologies and components, discrete and integrated circuits technology development for special applications, LiNbO3 applications like SAW, Ti diffused, light wave guides and Mach-Zender light modulators. Specialty wafer fab processing: epitaxy, SiGe, epi, diffusion and oxidation, ion implant, LPCVD and PECVD Si3N4, SiO2, platinum silicidation, photo-lithography, plasma etching, silicon micro-machining by KOH anisotropic etch, sputter depositions of Ti/Ni/Ag lift off process, Ti/Pt/Au lift off process, sputter depositions of thin film resistors : SiCr, NiCr, TaN2, silicon wafers back grind and polish followed by trimetal backside sputter depositions, gold backside sputter depositions and alloy : gold electroplating and gold bump. SEMICONWELL designs and manufacture standard and custom Integrated Passive Networks - IPN for the personal computer, telecommunications, industrial controls, automotive, avionics. The Integrated Passive Networks are a sum of resistors, capacitors, inductors, diodes and schottky diodes and are available in through hole and surface mounted packages. SEMICONWELL is supplying integrated termination, filters and ESD protection for use in mobile phones, PDAs, personal computers, notebooks, routers, hubs, internet appliances. Standard Devices - Most standard devices include resistors, capacitors, inductors, diodes and schottky diodes networks and are inventoried by the designated part numbers and can be ordered on line, from factory or from distributors. Custom Devices - Custom IPN (Integrated Passive Networks) are manufactured from customer's prints upon request. US MICROWAVES develops, manufactures and supplies high quality standard microwave thin film circuits and microwave devices including RF bipolars for hybrid chip and wire applications as follows: microwave thin film circuits, custom manufacturing from customer's data, spiral chip inductors - ceramic, sapphire and quartz substrate, thin film resistors - ceramic, silicon and quartz substrates, multi-tap thin film resistors - ceramic and silicon substrates, capacitors MIS for chip and wire applications, MNOS capacitors, MOS capacitors, ceramic capacitors, Schottky, PIN, tunnel, SRD, varactor and zero bias diodes, RF NPN and PNP transistors, high speed LDMOS and T MOSFET s, MMIC - RF IC s silicon and SiGe.
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semiconix semiconductor - where the future is today - gold chip technology RECTIFIER_DIODES
INFINEON
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GOLD CHIP TECHNOLOGY™
 
1-3A →1A →

INFINEON 1-3A rectifier diodes
BAT60ASMXDS10V3ABARE DIEFLIP CHIPnDFN
BAT60BSMXDS10V3ABARE DIEFLIP CHIPnDFN

INFINEON 1A rectifier diodes
BAS140WSMXDS40V0A120BARE DIEFLIP CHIPnDFN BAT24-02LSSMXDS4V0A110BARE DIEFLIP CHIPnDFN
BAS170WSMXDS70V0A070BARE DIEFLIP CHIPnDFN BAT240ASMXDS240V0A400BARE DIEFLIP CHIPnDFN
BAS3005A-02VSMXDS30V0.5ABARE DIEFLIP CHIPnDFN BAT54SMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAS3005B-02VSMXDS30V0.5ABARE DIEFLIP CHIPnDFN BAT54-02LRHSMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAS3010A-03WSMXDS30V1ABARE DIEFLIP CHIPnDFN BAT54-06SMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAS3010B-03WSMXDS30V1ABARE DIEFLIP CHIPnDFN BAT54-06WSMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAS40SMXDS40V0A120BARE DIEFLIP CHIPnDFN BAT54WSMXDS30V0A200BARE DIEFLIP CHIPnDFN
BAS40-02LSMXDS40V0A120BARE DIEFLIP CHIPnDFN BAT62-02LSMXDS40V0A020BARE DIEFLIP CHIPnDFN
BAS52-02VSMXDS45V0.75ABARE DIEFLIP CHIPnDFN BAT62-02LSSMXDS40V0A020BARE DIEFLIP CHIPnDFN
BAS70SMXDS70V0A070BARE DIEFLIP CHIPnDFN BAT62-02WSMXDS40V0A020BARE DIEFLIP CHIPnDFN
BAS70-02LSMXDS70V0A070BARE DIEFLIP CHIPnDFN BAT62-03WSMXDS40V0A020BARE DIEFLIP CHIPnDFN
BAS70-02WSMXDS70V0A070BARE DIEFLIP CHIPnDFN BAT63-02VSMXDS3V0A100BARE DIEFLIP CHIPnDFN
BAS70-04SSMXDS70V0A070BARE DIEFLIP CHIPnDFN BAT64SMXDS40V0A250BARE DIEFLIP CHIPnDFN
BAT15-02LRHSMXDS4V0A110BARE DIEFLIP CHIPnDFN BAT64-02WSMXDS40V0A250BARE DIEFLIP CHIPnDFN
BAT15-03WSMXDS4V0A110BARE DIEFLIP CHIPnDFN BAT64-04TSMXDS40V0A250BARE DIEFLIP CHIPnDFN
BAT15-07LRHSMXDS4V0A110BARE DIEFLIP CHIPnDFN BAT68SMXDS8V0A130BARE DIEFLIP CHIPnDFN
BAT15-099SMXDS4V0A110BARE DIEFLIP CHIPnDFN
BAT165SMXDS40V0.75ABARE DIEFLIP CHIPnDFN
BAT17SMXDS4V0A130BARE DIEFLIP CHIPnDFN

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