SMX CS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR same as ON Semiconductor CS5208, Cherry Semiconductor CS5208-1, Cherry Semiconductor CS5208-1GT3, ON Semiconductor CS5208-1, ON Semiconductor CS5208-1-D, ON Semiconductor CS5208-1GT3 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Cherry Semiconductor CS5208-1, ON Semiconductor CS5208-1 SMX CS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR same as ON Semiconductor CS5208, Cherry Semiconductor CS5208-1, Cherry Semiconductor CS5208-1GT3, ON Semiconductor CS5208-1, ON Semiconductor CS5208-1-D, ON Semiconductor CS5208-1GT3 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. Cherry Semiconductor CS5208-1, ON Semiconductor CS5208-1 REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=CS5208">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXCS5208&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMX CS5208 - BARE DIE GOLD CHIP TECHNOLOGY™ LOW DROPOUT POSITIVE VOLTAGE REGULATOR FEATURES APPLICATIONS LDO VOLTAGE REGULATOR Ajustable or Fixed Output Output Current of 8A Low Dropout 700mV at 8A Output Current 0.04% Line Regulation 0.1% Load regulation 100% Trermal limit Burn-In Fast Transient Response Remote sense In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS CS5208 CS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR SMXCS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR - PRODUCT DESCRIPTION The SMX CS5208 series of positive ajustable and fixed regulators are designed to provide 8A with higher eficiency than curently available device. All internal circuitry is designed to operate down to 700mW input to output differential and the dropout voltage is fully specified as a function of load current. Dropout voltage of the device is 100mV at light load and rising to 700 mV at maximum output current. A second low current is required to achieve this dropout.The CS5208 can also be used as a single supply device (3 pin version). On-chip trimming adjusts the reference voltage to 1%. The CS5208 series are ideal to power the next generation of advanced microprocessor on the motherboards where both 5V and 3.3V supplies are available. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions. SCHEMATIC DIAGRAM CS5208 ON Semiconductor CS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR CS5208 MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Dissipation Pd Internally limited W Input Voltage Vpower Vcontrol Vin 7 13 V Operating Junction Temperature Range Control Section Power Transistor Tj 0 to 125 0 to150 °C Operating Junction Temperature Tj 150 °C Storage Temperature Range Tstg -65 to +150 °C Lead Temperature (Soldering, 10 sec.) Tlead 300 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. CS5208 ELECTRICAL CHARACTERISTIC (Note1) ILOAD=0mA and TJ=+250C unless otherwise specified. PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Reference Voltage VCONTROL=2.75V; VPOWER=2V; ILOAD=10mA VCONTROL=2.7V to 12V; VPOWER=3.3V to 5.5V ILOAD=10mA to 8A 1.238 1.230 1.250 1.250 1.262 1.270 V Output Voltage VCONTROL=VOUT +1.5V; VPOWER=VOUT +0.5V VCONTROL=VOUT + 1.5V; VPOWER=VOUT + 0.8V ILOAD=0mA to 8A -1 -1.6 +1 +1.6 V Line Regulation ILOAD=10mA; (1.5V+VOUT)≤VCONTROL≤12V 0.8≤(VPOWER-VOUT)≤5.5V 0.04 0.2 % Line Regulation VCONTROL=VOUT+2.5V; VPOWER=VOUT+0.8V ILOAD=10mA to 8A 0.08 0.4 % Minimum Load Current (Note2) VCONTROL=5V; VPOWER=3.3V; VADJ=0V 1.7 5 mA Control Pin Current (Note3) VCONTROL=VOUT+1.5V; VPOWER=VOUT+0.8V ILOAD=10mA to 8A 200 mA Ground Pin Current VCONTROL=VOUT+2.5V; VPOWER=VOUT+0.8V ILOAD=0mA to 8A 6 10 mA Adjust Pin Current VCONTROL=2.75V; VPOWER=2.05V; ILOAD=10mA 50 120 µA Current Limit VIN-VOUT=3V 8 10 A Ripple Rejection VCONTROL=VPOWER=VOUT+2.5V; VRIPPLE=1VP-P 60 80 dB Thermal Regulation TA=25°C, 30 ms pulse 0.003 %/W Dropout Voltage (Note 4) Control Input (VCONTROL-VOUT) VPOWER=VOUT+0.8V; ILOAD=10mA 1 1.15 1.30 V Power Input VPOWER-VOUT VCONTROL=VOUT+2.5V; ILOAD=3A 0.55 0.70 V (NOTE 1) VOUT=VSENSE; VADJ=0 unless otherwise specified (NOTE 2) For the adjustable device the minimum load current is the minimum current required to mantain regulation. Normally the current in the resistor devider used to set the output voltage is selected to meet the minimum load current requirement. (NOTE 3) The control pin current is the driver current required for the output transistor. This current will track output current whit a ratio of about 1:100 (NOTE 4) The dropout voltage for the CS5208 is caused by either minimum control voltage or minimum power voltage. The specification represent the minimum input/output voltage required to mantain 1% regulation. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 122 x 103.15 ±1 [3.1 x 2.62] min 7x7 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. CS5208 DIE LAYOUT - MECHANICAL SPECIFICATIONS CS5208 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 1.55 61.024 2.225 87.598 2 OUT 0.43 16.929 1.8 3 OUT 2.67 105.118 1.8 4 VPower 1.55 61.024 1.375 5 VControl 1.25 49.212 0.935 6 Sense 0.205 8.07 0.665 7 Adjust (adjustable output) GND (fixed output) 0.205 8.07 0.205 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. CS5208 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USM CS5208 100pc -WP $3.20 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXCS5208&idx=21">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission. Valid XHTML 1.0 Transitional by http://validator.w3.org

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMX CS5208 - BARE DIE
GOLD CHIP TECHNOLOGY™ LOW DROPOUT POSITIVE VOLTAGE REGULATOR

FEATURES APPLICATIONS LDO VOLTAGE REGULATOR
Ajustable or Fixed Output
Output Current of 8A
Low Dropout 700mV at 8A Output Current
0.04% Line Regulation
0.1% Load regulation
100% Trermal limit Burn-In
Fast Transient Response
Remote sense

In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS









CS5208 CS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR

SMXCS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR - PRODUCT DESCRIPTION
The SMX CS5208 series of positive ajustable and fixed regulators are designed to provide 8A with higher eficiency than curently available device. All internal circuitry is designed to operate down to 700mW input to output differential and the dropout voltage is fully specified as a function of load current. Dropout voltage of the device is 100mV at light load and rising to 700 mV at maximum output current. A second low current is required to achieve this dropout.The CS5208 can also be used as a single supply device (3 pin version). On-chip trimming adjusts the reference voltage to 1%. The CS5208 series are ideal to power the next generation of advanced microprocessor on the motherboards where both 5V and 3.3V supplies are available.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS
Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.


SCHEMATIC DIAGRAM
CS5208 ON Semiconductor CS5208 LOW DROPOUT POSITIVE VOLTAGE REGULATOR

CS5208 MAXIMUM RATINGS
PARAMETERSYMBOLVALUEUNITS
Power DissipationPdInternally limitedW
Input Voltage Vpower VcontrolVin 7 13V
Operating Junction Temperature Range Control Section Power TransistorTj 0 to 125 0 to150°C
Operating Junction TemperatureTj 150°C
Storage Temperature RangeTstg-65 to +150°C
Lead Temperature (Soldering, 10 sec.)Tlead300°C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

CS5208 ELECTRICAL CHARACTERISTIC
(Note1) ILOAD=0mA and TJ=+250C unless otherwise specified.
PARAMETERTEST CONDITIONSSYMBOLMINTYPMAXUNITS
Reference VoltageVCONTROL=2.75V; VPOWER=2V; ILOAD=10mA VCONTROL=2.7V to 12V; VPOWER=3.3V to 5.5V ILOAD=10mA to 8A1.238 1.2301.250 1.2501.262 1.270 V
Output VoltageVCONTROL=VOUT +1.5V; VPOWER=VOUT +0.5V VCONTROL=VOUT + 1.5V; VPOWER=VOUT + 0.8V ILOAD=0mA to 8A-1 -1.6+1 +1.6V
Line RegulationILOAD=10mA; (1.5V+VOUT)≤VCONTROL≤12V 0.8≤(VPOWER-VOUT)≤5.5V0.040.2%
Line RegulationVCONTROL=VOUT+2.5V; VPOWER=VOUT+0.8V ILOAD=10mA to 8A0.08 0.4%
Minimum Load Current (Note2)VCONTROL=5V; VPOWER=3.3V; VADJ=0V1.75mA
Control Pin Current (Note3)VCONTROL=VOUT+1.5V; VPOWER=VOUT+0.8V ILOAD=10mA to 8A200 mA
Ground Pin CurrentVCONTROL=VOUT+2.5V; VPOWER=VOUT+0.8V ILOAD=0mA to 8A610 mA
Adjust Pin CurrentVCONTROL=2.75V; VPOWER=2.05V; ILOAD=10mA50120 µA
Current LimitVIN-VOUT=3V810A
Ripple RejectionVCONTROL=VPOWER=VOUT+2.5V; VRIPPLE=1VP-P6080dB
Thermal RegulationTA=25°C, 30 ms pulse0.003%/W
Dropout Voltage (Note 4)
Control Input (VCONTROL-VOUT)VPOWER=VOUT+0.8V; ILOAD=10mA1 1.151.30V
Power Input VPOWER-VOUTVCONTROL=VOUT+2.5V; ILOAD=3A0.550.70V
(NOTE 1) VOUT=VSENSE; VADJ=0 unless otherwise specified
(NOTE 2) For the adjustable device the minimum load current is the minimum current required to mantain regulation. Normally the current in the resistor devider used to set the output voltage is selected to meet the minimum load current requirement.
(NOTE 3) The control pin current is the driver current required for the output transistor. This current will track output current whit a ratio of about 1:100
(NOTE 4) The dropout voltage for the CS5208 is caused by either minimum control voltage or minimum power voltage. The specification represent the minimum input/output voltage required to mantain 1% regulation.

SPICE MODEL
Spice model pending.
 
CROSS REFERENCE PARTS
Cherry Semiconductor CS5208-1, ON Semiconductor CS5208-1

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
mils [mm]
Bonding pads Backside metallization
Silicon 10 122 x 103.15 ±1
[3.1 x 2.62]
min 7x7 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.

CS5208 DIE LAYOUT - MECHANICAL SPECIFICATIONSCS5208 DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #FUNCTIONX(mils)X(mm)Y(mils)
11.5561.0242.22587.598
2OUT0.4316.9291.8
3OUT2.67105.1181.8
4VPower1.5561.0241.375
5VControl1.2549.2120.935
6Sense0.2058.070.665
7Adjust (adjustable output) GND (fixed output)0.2058.070.205

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

CS5208 STANDARD PRODUCTS PRICE LIST
USM PART #MINIMUM ORDER QUANTITYWaffle PacksU/P($)
USM CS5208100pc-WP$3.20
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONIX SEMICONDUCTOR technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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