SMX LM2931 LOW DROPOUT REGULATORS same as BayLinear LM2931, BayLinear LM2931R, BayLinear LM2931R-85, BayLinear LM2931R-90, BayLinear LM2931R-90, BayLinear LM2931M-90, BayLinear LM2931M-90, BayLinear LM2931Z-10, BayLinear LM2931Z-10, BayLinear LM2931Z-12, BayLinear LM2931Z-12, BayLinear LM2931Z-15, BayLinear LM2931R-85, BayLinear LM2931R-80, BayLinear LM2931R-80, BayLinear LM2931R-10, BayLinear LM2931R-10, BayLinear LM2931R-12, BayLinear LM2931R-12, BayLinear LM2931R-15, BayLinear LM2931R-15, BayLinear LM2931R-33, BayLinear LM2931R-33, BayLinear LM2931R, BayLinear LM2931R-50, BayLinear LM2931Z-15, BayLinear LM2931Z-33, BayLinear LM2931Z-90, BayLinear LM2931R-50, BayLinear LM2931M-33, BayLinear LM2931M-15, BayLinear LM2931M-15, BayLinear LM2931M-12, BayLinear LM2931M-12, BayLinear LM2931M-10, BayLinear LM2931M-10, BayLinear LM2931M, BayLinear LM2931M, BayLinear LM2931M-33, BayLinear LM2931M-50, BayLinear LM2931M-50, BayLinear LM2931Z-33, BayLinear LM2931M-85, BayLinear LM2931Z-50, BayLinear LM2931M-85, BayLinear LM2931M-80, BayLinear LM2931Z-85, BayLinear LM2931Z-85, BayLinear LM2931Z-90, BayLinear LM2931, BayLinear LM2931M-80, BayLinear LM2931Z-50, Calogic CLM2931AS-4.0, Calogic CLM2931AS-3.3, Calogic CLM2931A-5, Calogic CLM2931A-33, Calogic CLM2931A-3, Calogic CLM2931A, Calogic CLM2931-5, Calogic CLM2931-33, Calogic CLM2931-3, Calogic CLM2931AS-3.5, Calogic CLM2931AS-4.5, Calogic CLM2931AS-5.0, Calogic CLM2931AS-X, Calogic CLM2931C, Calogic CLM2931, Fairchild Semiconductor LM2931AZ5X, Fairchild Semiconductor LM2931AZ5, Fairchild Semiconductor LM2931AZ5XA, Fairchild Semiconductor LM2931A, Motorola LM2931CD2T, Motorola LM2931ADT-5.0, Motorola LM2931CT, Motorola LM2931CTH, Motorola LM2931CTV, Motorola LM2931D2T-5.0, Motorola LM2931D-5.0, Motorola LM2931DT, Motorola LM2931DT-5.0, Motorola LM2931T-5.0, Motorola LM2931Z, Motorola LM2931Z-5.0, Motorola LM2931CD, Motorola LM2931AZ-5.0, Motorola LM2931AD-5.0, Motorola LM2931ACT, Motorola LM2931ADT-1-5.0, Motorola LM2931ACTH, Motorola LM2931AD2T-5.0, Motorola LM2931DT-1-5.0, Motorola LM2931ACD, Motorola LM2931AT-5.0, Motorola LM2931ACTV, Motorola LM2931ACD2T, National Semiconductor LM2931M-5.0, National Semiconductor LM2931CT, National Semiconductor LM2931AZ-5.0, National Semiconductor LM2931MX-5.0, National Semiconductor LM2931AT-5.0, National Semiconductor LM2931ASX-5.0, National Semiconductor LM2931AS-5.0, National Semiconductor LM2931AM-5.0, National Semiconductor LM2931IBPX-5.0, National Semiconductor LM2931IBPX-3.3, National Semiconductor LM2931IBP-5.0, National Semiconductor LM2931IBP-3.3, National Semiconductor LM2931T-5.0, National Semiconductor LM2931S-5.0, National Semiconductor LM2931AMX-5.0, National Semiconductor LM2931Z-5.0, National Semiconductor LM2931C MWC, National Semiconductor LM2931CMX, National Semiconductor LM2931CM, National Semiconductor LM2931CS, National Semiconductor LM2931CSX, National Semiconductor LM2931, National Semiconductor LM2931SX-5.0, ON Semiconductor LM2931ACDR2, ON Semiconductor LM2931ACD2T, ON Semiconductor LM2931Z-5.0, ON Semiconductor LM2931Z-5.0RA, ON Semiconductor LM2931Z-5.0RP, ON Semiconductor LM2931ACD, ON Semiconductor LM2931, ON Semiconductor LM2931T-5.0, ON Semiconductor LM2931ACT, ON Semiconductor LM2931ACTV, ON Semiconductor LM2931ACTH, ON Semiconductor LM2931AD2T-5.0, ON Semiconductor LM2931AD2T-5.0R4, ON Semiconductor LM2931AD-5.0, ON Semiconductor LM2931CD2TR4, ON Semiconductor LM2931AD-5.0R2, ON Semiconductor LM2931ADT-1-5.0, ON Semiconductor LM2931ACD2TR4, ON Semiconductor LM2931ADT-5.0, ON Semiconductor LM2931ADT-5.0RK, ON Semiconductor LM2931AT-5.0, ON Semiconductor LM2931AZ-5.0, ON Semiconductor LM2931D-5.0, ON Semiconductor LM2931D-5.0R2, ON Semiconductor LM2931D2T-5.0R4, ON Semiconductor LM2931D2T-5.0, ON Semiconductor LM2931AZ-5.0RP, ON Semiconductor LM2931AZ-5.0RA, ON Semiconductor LM2931DT-1-5.0, ON Semiconductor LM2931DT-5.0, ON Semiconductor LM2931-D, ON Semiconductor LM2931CTV, ON Semiconductor LM2931CD, ON Semiconductor LM2931CTH, ON Semiconductor LM2931CT, ON Semiconductor LM2931CDR2, ON Semiconductor LM2931CD2T, SGS Thomson Microelectronics LM2931BD33, SGS Thomson Microelectronics LM2931AZ50, SGS Thomson Microelectronics LM2931AD33, SGS Thomson Microelectronics LM2931AD50, SGS Thomson Microelectronics LM2931-SERIES, SGS Thomson Microelectronics LM2931AV33, SGS Thomson Microelectronics LM2931AZ33, SGS Thomson Microelectronics LM2931ADT33, SGS Thomson Microelectronics LM2931AV50, SGS Thomson Microelectronics LM2931ADT50, ST Microelectronics LM2931AD50, ST Microelectronics LM2931BD33, ST Microelectronics LM2931AV33, ST Microelectronics LM2931AV50, ST Microelectronics LM2931BZ50, ST Microelectronics LM2931BZ33, ST Microelectronics LM2931BXX50, ST Microelectronics LM2931BV50, ST Microelectronics LM2931BV33, ST Microelectronics LM2931BDT50R, ST Microelectronics LM2931, ST Microelectronics LM2931BDT50, ST Microelectronics LM2931BDT33, ST Microelectronics LM2931AXX33, ST Microelectronics LM2931AZ50R, ST Microelectronics LM2931AD50R, ST Microelectronics LM2931D-R, ST Microelectronics LM2931AD33, ST Microelectronics LM2931ADT33, ST Microelectronics LM2931AZ33, ST Microelectronics LM2931D, ST Microelectronics LM2931ADT50, ST Microelectronics LM2931ADT50R, ST Microelectronics LM2931BD50, ST Microelectronics LM2931AZ50, ST Microelectronics LM2931XX, ST Microelectronics LM2931AZ50AP, ST Microelectronics LM2931AXX50, Wing Shing Computer Components LM2931CT-5.0, Wing Shing Computer Components LM2931ACT-5.0 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. BayLinear LM2931, Calogic CLM2931, Fairchild Semiconductor LM2931A, Motorola LM2931ACD, National Semiconductor LM2931, ON Semiconductor LM2931, SGS Thomson Microelectronics LM2931AD33, ST Microelectronics LM2931, Wing Shing Computer Components LM2931ACT-5.0 SMX LM2931 LOW DROPOUT REGULATORS same as BayLinear LM2931, BayLinear LM2931R, BayLinear LM2931R-85, BayLinear LM2931R-90, BayLinear LM2931R-90, BayLinear LM2931M-90, BayLinear LM2931M-90, BayLinear LM2931Z-10, BayLinear LM2931Z-10, BayLinear LM2931Z-12, BayLinear LM2931Z-12, BayLinear LM2931Z-15, BayLinear LM2931R-85, BayLinear LM2931R-80, BayLinear LM2931R-80, BayLinear LM2931R-10, BayLinear LM2931R-10, BayLinear LM2931R-12, BayLinear LM2931R-12, BayLinear LM2931R-15, BayLinear LM2931R-15, BayLinear LM2931R-33, BayLinear LM2931R-33, BayLinear LM2931R, BayLinear LM2931R-50, BayLinear LM2931Z-15, BayLinear LM2931Z-33, BayLinear LM2931Z-90, BayLinear LM2931R-50, BayLinear LM2931M-33, BayLinear LM2931M-15, BayLinear LM2931M-15, BayLinear LM2931M-12, BayLinear LM2931M-12, BayLinear LM2931M-10, BayLinear LM2931M-10, BayLinear LM2931M, BayLinear LM2931M, BayLinear LM2931M-33, BayLinear LM2931M-50, BayLinear LM2931M-50, BayLinear LM2931Z-33, BayLinear LM2931M-85, BayLinear LM2931Z-50, BayLinear LM2931M-85, BayLinear LM2931M-80, BayLinear LM2931Z-85, BayLinear LM2931Z-85, BayLinear LM2931Z-90, BayLinear LM2931, BayLinear LM2931M-80, BayLinear LM2931Z-50, Calogic CLM2931AS-4.0, Calogic CLM2931AS-3.3, Calogic CLM2931A-5, Calogic CLM2931A-33, Calogic CLM2931A-3, Calogic CLM2931A, Calogic CLM2931-5, Calogic CLM2931-33, Calogic CLM2931-3, Calogic CLM2931AS-3.5, Calogic CLM2931AS-4.5, Calogic CLM2931AS-5.0, Calogic CLM2931AS-X, Calogic CLM2931C, Calogic CLM2931, Fairchild Semiconductor LM2931AZ5X, Fairchild Semiconductor LM2931AZ5, Fairchild Semiconductor LM2931AZ5XA, Fairchild Semiconductor LM2931A, Motorola LM2931CD2T, Motorola LM2931ADT-5.0, Motorola LM2931CT, Motorola LM2931CTH, Motorola LM2931CTV, Motorola LM2931D2T-5.0, Motorola LM2931D-5.0, Motorola LM2931DT, Motorola LM2931DT-5.0, Motorola LM2931T-5.0, Motorola LM2931Z, Motorola LM2931Z-5.0, Motorola LM2931CD, Motorola LM2931AZ-5.0, Motorola LM2931AD-5.0, Motorola LM2931ACT, Motorola LM2931ADT-1-5.0, Motorola LM2931ACTH, Motorola LM2931AD2T-5.0, Motorola LM2931DT-1-5.0, Motorola LM2931ACD, Motorola LM2931AT-5.0, Motorola LM2931ACTV, Motorola LM2931ACD2T, National Semiconductor LM2931M-5.0, National Semiconductor LM2931CT, National Semiconductor LM2931AZ-5.0, National Semiconductor LM2931MX-5.0, National Semiconductor LM2931AT-5.0, National Semiconductor LM2931ASX-5.0, National Semiconductor LM2931AS-5.0, National Semiconductor LM2931AM-5.0, National Semiconductor LM2931IBPX-5.0, National Semiconductor LM2931IBPX-3.3, National Semiconductor LM2931IBP-5.0, National Semiconductor LM2931IBP-3.3, National Semiconductor LM2931T-5.0, National Semiconductor LM2931S-5.0, National Semiconductor LM2931AMX-5.0, National Semiconductor LM2931Z-5.0, National Semiconductor LM2931C MWC, National Semiconductor LM2931CMX, National Semiconductor LM2931CM, National Semiconductor LM2931CS, National Semiconductor LM2931CSX, National Semiconductor LM2931, National Semiconductor LM2931SX-5.0, ON Semiconductor LM2931ACDR2, ON Semiconductor LM2931ACD2T, ON Semiconductor LM2931Z-5.0, ON Semiconductor LM2931Z-5.0RA, ON Semiconductor LM2931Z-5.0RP, ON Semiconductor LM2931ACD, ON Semiconductor LM2931, ON Semiconductor LM2931T-5.0, ON Semiconductor LM2931ACT, ON Semiconductor LM2931ACTV, ON Semiconductor LM2931ACTH, ON Semiconductor LM2931AD2T-5.0, ON Semiconductor LM2931AD2T-5.0R4, ON Semiconductor LM2931AD-5.0, ON Semiconductor LM2931CD2TR4, ON Semiconductor LM2931AD-5.0R2, ON Semiconductor LM2931ADT-1-5.0, ON Semiconductor LM2931ACD2TR4, ON Semiconductor LM2931ADT-5.0, ON Semiconductor LM2931ADT-5.0RK, ON Semiconductor LM2931AT-5.0, ON Semiconductor LM2931AZ-5.0, ON Semiconductor LM2931D-5.0, ON Semiconductor LM2931D-5.0R2, ON Semiconductor LM2931D2T-5.0R4, ON Semiconductor LM2931D2T-5.0, ON Semiconductor LM2931AZ-5.0RP, ON Semiconductor LM2931AZ-5.0RA, ON Semiconductor LM2931DT-1-5.0, ON Semiconductor LM2931DT-5.0, ON Semiconductor LM2931-D, ON Semiconductor LM2931CTV, ON Semiconductor LM2931CD, ON Semiconductor LM2931CTH, ON Semiconductor LM2931CT, ON Semiconductor LM2931CDR2, ON Semiconductor LM2931CD2T, SGS Thomson Microelectronics LM2931BD33, SGS Thomson Microelectronics LM2931AZ50, SGS Thomson Microelectronics LM2931AD33, SGS Thomson Microelectronics LM2931AD50, SGS Thomson Microelectronics LM2931-SERIES, SGS Thomson Microelectronics LM2931AV33, SGS Thomson Microelectronics LM2931AZ33, SGS Thomson Microelectronics LM2931ADT33, SGS Thomson Microelectronics LM2931AV50, SGS Thomson Microelectronics LM2931ADT50, ST Microelectronics LM2931AD50, ST Microelectronics LM2931BD33, ST Microelectronics LM2931AV33, ST Microelectronics LM2931AV50, ST Microelectronics LM2931BZ50, ST Microelectronics LM2931BZ33, ST Microelectronics LM2931BXX50, ST Microelectronics LM2931BV50, ST Microelectronics LM2931BV33, ST Microelectronics LM2931BDT50R, ST Microelectronics LM2931, ST Microelectronics LM2931BDT50, ST Microelectronics LM2931BDT33, ST Microelectronics LM2931AXX33, ST Microelectronics LM2931AZ50R, ST Microelectronics LM2931AD50R, ST Microelectronics LM2931D-R, ST Microelectronics LM2931AD33, ST Microelectronics LM2931ADT33, ST Microelectronics LM2931AZ33, ST Microelectronics LM2931D, ST Microelectronics LM2931ADT50, ST Microelectronics LM2931ADT50R, ST Microelectronics LM2931BD50, ST Microelectronics LM2931AZ50, ST Microelectronics LM2931XX, ST Microelectronics LM2931AZ50AP, ST Microelectronics LM2931AXX50, Wing Shing Computer Components LM2931CT-5.0, Wing Shing Computer Components LM2931ACT-5.0 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. BayLinear LM2931, Calogic CLM2931, Fairchild Semiconductor LM2931A, Motorola LM2931ACD, National Semiconductor LM2931, ON Semiconductor LM2931, SGS Thomson Microelectronics LM2931AD33, ST Microelectronics LM2931, Wing Shing Computer Components LM2931ACT-5.0 REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=LM2931">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLM2931&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMX LM2931 - BARE DIE GOLD CHIP TECHNOLOGY™ LOW DROPOUT REGULATORS FEATURES APPLICATIONS LDO VOLTAGE REGULATOR Very low quiescent current Output current in excess of 100mA Input-output differential less than 0.6V Reverse battery protection; 60V load dump protection 50V reverse transient protection Short circuit protection Internal thermal overload protection Mirror-image insertion protection In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS. LM2931 LM2931 LOW DROPOUT REGULATORS SMXLM2931 LOW DROPOUT REGULATORS - PRODUCT DESCRIPTION The SMX LM2931 positive voltage regulator features a very low quiescent current of 1mA or less when supplying 10mA loads.This unique characteristic and the extremely low input-output differential required for proper regulation (0.2V for output currents of 10mA) make the LM2931 the ideal regulator for standby power systems. Applications include memory standby circuits, CMOS and other low power processor power supplies as well as systems demanding as much as100mA of output current. Designed originally for automotive applications, theLM2931 and all regulated circuitry are protected from reverse batter installations or 2 battery jumps. During line transients, such as a load dump (60V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shutdown to protect both internal circuits and the load. The LM2931 cannot be harmed by temporary mirror-image insertion. Familiar regulator features such as short circuit and thermal overload protection are also provided. The LM2931 family includes a fixed 5V output (±3.8% tolerance for A grade) or anadjustable output with ON/OFF pin. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions. SCHEMATIC DIAGRAM LM2931 BayLinear LM2931 LOW DROPOUT REGULATORS LM2931 MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Input Voltage Operating Range Overvoltage Protection VIN 26 50 V Internal Power Dissipation (Note2) PD Internally Limited W Operating Ambient Temperature Range Top -40 to 85 °C Maximum Junction Temperature TJ 125 °C Storage Temperature Range Tstg -65 to +150 °C Lead Temperature (Soldering, 10 sec) Tlead 230 °C ESD Tolerance (Note4) 2000 V ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. LM2931 ELECTRICAL CHARACTERISTIC VIN=14V, IO=10mA,TJ=25°C,C2=100µF(unless otherwise specified)(Note2) PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS OutputVoltage 4V≤ VIN≤ 26V, IO=100mA -40°C≤ TJ≤ 125°C 3.3 3.465 3.135 3.630 2.970 VMAX VMIN VMAX VMIN Line Regulation 4V≤ VIN≤ 26V 4 33 mVMAX Load Regulation 5mA≤ IO≤ 100m 10 50 mVMAX Output Impedance 100mADC and 10mArms 100Hz - 10KHz 200 mΩ Output Noise Voltage 10Hz-100kHz, COUT=100 µF 330 µVrms Quiescent current IO≤ 10mA, 4V≤ VIN≤ 26V -40 °C≤ TJ≤ 125 °C IO=100mA, VIN=14V, TJ=25°C 0.4 1.0 mAMAX mA Long Term Stability 13 mV/1000h Ripple Rejection fO=120H 80 dB Dropout Voltage IO=10mA IO=100mA 0.05 0.30 0.2 0.6 VMAX Maximum Operational Input Voltage 33 26 VMIN Maximum Line Transient RL=500, VO≤ 5.5V, T=1ms,t≤100ms 70 50 VMIN Reverse Polarity Input Voltage, DC VO≥0.3V, RL=500 ohms 30 -15 VMIN ReversePolarityInputVoltage,Transient T=1ms, t≤100ms,RL=500 ohms -80 -50 VMIN OutputVoltage 6V≤ VIN≤26V, IO=100mA -40°C≤TJ≤125°C 5 5.25 4.75 5.5 4.5 VMAX VMIN VMAX VMIN Line Regulation 9V≤ VIN≤16V 6V≤ VIN≤ 26V 2 4 10 30 mVMAX Load Regulation 5mA≤ IO≤ 100m 14 50 mVMAX Output Impedance 100mADC and 10mArms 100Hz - 10KHz 200 mΩ Quiescent Current IO≤10mA,6V≤VIN≤26V 40°C≤ TJ≤ 125°C IO=100mA,VIN=14V,TJ=25°C 0.4 1.0 15 mAMAX mAMAX Output Noise Voltage Long Term Stability 10Hz-100kHz,COUT=100µF 500 20 µVrms mV/1000hr Dropout Voltage IO=10mA IO=100mA 0.05 0.30 0.2 0.6 VMAX Ripple Rejection fO=120Hz 80 dBMIN Maximum Operational Input Voltage 33 26 VMIN Maximum Line Transient RL=500, VO≤ 5.5V, T=1ms,t≤100ms 70 50 VMIN Reverse Polarity Input Voltage, DC VO≥-0.3V, RL=500 ohms -30 -15 VMIN ReversePolarityInputVoltage,Transient T=1ms, t≤100ms,RL=500 ohms -80 -50 VMIN Reference Voltage IO≤100mA, 40°C≤Tj≤125°C, R1=27k Measured from VOUT toAdjust Pin 1.20 1.26 1.14 1.32 1.08 VMAX VMIN VMAX VMIN Output Voltage Range 24 VMAX Line Regulation VOUT + 0.6V≤ VIN≤ 26V 0.2 1.5 mV/VMAX Load Regulation 5mA≤ IO≤100mA 0.3 1 %MAX Output Impedance 100mADC and 10mArms, 100Hz–10kHz 40 mW/V Quiescent Current IO=10mA IO=100mA Durring Shutdown RL=500W 0.4 15 0.8 1 1 mAMAX mA mAMAX Output Noise Voltage 10Hz–100kHz 100 µVrms/V Long Term Stability 0.4 %/1000hr Ripple Rejection fO=120Hz 0.02 %/V Dropout Voltage IO≤ 10mA IO=100mA 0.05 0.3 0.2 0.6 VMAX VMAX Maximum Operational Input Voltage 33 26 VMIN Maximum Line Transient IO=10mA, ReferenceVoltage≤1.5V T=1ms, t≤ 100ms 70 60 VMIN Reverseolarity Input Voltage, Transient T=1ms, t≤100ms RL=500W -80 -50 VMIN On/Off Threshold Voltage On Off VO= 3V 2.0 2.2 1.2 3.25 VMAX VMIN On/Off Threshold Current 20 50 µAMAX (NOTE 1) Absolute Maximum Rating sindicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions. (NOTE 2) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing isused. (NOTE 3) All lmits are guaranteed for TJ=25°C (standard type face) or over the full operating junction temperature range of 40°C to +125°C (bold type face). (NOTE 4)Human body model, 100pF discharged through 1.5k. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 73.622 x 56.693 ±1 [1.87 x 1.44] min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LM2931 DIE LAYOUT - MECHANICAL SPECIFICATIONS LM2931 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 OUTPUT 4.331 0.11 3.74 2 INPUT 4.331 0.11 48.031 3 GND 37.598 0.955 20.669 4 SHUTDOWN 65.157 1.655 48.228 5 FEEDBACK 65.157 1.655 3.74 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. LM2931 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USM LM2931 100pc -WP $3.20 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXLM2931&idx=6">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission. Valid XHTML 1.0 Transitional by http://validator.w3.org

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semiconix semiconductor - where the future is today - gold chip technology SMX LM2931 - BARE DIE
GOLD CHIP TECHNOLOGY™ LOW DROPOUT REGULATORS

FEATURES APPLICATIONS LDO VOLTAGE REGULATOR
Very low quiescent current
Output current in excess of 100mA
Input-output differential less than 0.6V
Reverse battery protection;
60V load dump protection
50V reverse transient protection
Short circuit protection
Internal thermal overload protection
Mirror-image insertion protection
In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS.









LM2931 LM2931 LOW DROPOUT REGULATORS

SMXLM2931 LOW DROPOUT REGULATORS - PRODUCT DESCRIPTION
The SMX LM2931 positive voltage regulator features a very low quiescent current of 1mA or less when supplying 10mA loads.This unique characteristic and the extremely low input-output differential required for proper regulation (0.2V for output currents of 10mA) make the LM2931 the ideal regulator for standby power systems. Applications include memory standby circuits, CMOS and other low power processor power supplies as well as systems demanding as much as100mA of output current. Designed originally for automotive applications, theLM2931 and all regulated circuitry are protected from reverse batter installations or 2 battery jumps. During line transients, such as a load dump (60V) when the input voltage to the regulator can momentarily exceed the specified maximum operating voltage, the regulator will automatically shutdown to protect both internal circuits and the load. The LM2931 cannot be harmed by temporary mirror-image insertion. Familiar regulator features such as short circuit and thermal overload protection are also provided. The LM2931 family includes a fixed 5V output (±3.8% tolerance for A grade) or anadjustable output with ON/OFF pin.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS
Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.


SCHEMATIC DIAGRAM
LM2931 BayLinear LM2931 LOW DROPOUT REGULATORS

LM2931 MAXIMUM RATINGS
PARAMETERSYMBOLVALUEUNITS
Input Voltage Operating Range Overvoltage ProtectionVIN 26 50V
Internal Power Dissipation (Note2)PDInternally LimitedW
Operating Ambient Temperature RangeTop-40 to 85°C
Maximum Junction TemperatureTJ125°C
Storage Temperature RangeTstg-65 to +150°C
Lead Temperature (Soldering, 10 sec)Tlead230°C
ESD Tolerance (Note4) 2000V
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

LM2931 ELECTRICAL CHARACTERISTIC
VIN=14V, IO=10mA,TJ=25°C,C2=100µF(unless otherwise specified)(Note2)
PARAMETERTEST CONDITIONSSYMBOLMINTYPMAXUNITS
OutputVoltage 4V≤ VIN≤ 26V, IO=100mA -40°C≤ TJ≤ 125°C3.33.465 3.135 3.630 2.970VMAX VMIN VMAX VMIN
Line Regulation4V≤ VIN≤ 26V433mVMAX
Load Regulation5mA≤ IO≤ 100m1050mVMAX
Output Impedance100mADC and 10mArms 100Hz - 10KHz200
Output Noise Voltage10Hz-100kHz, COUT=100 µF330µVrms
Quiescent currentIO≤ 10mA, 4V≤ VIN≤ 26V -40 °C≤ TJ≤ 125 °C IO=100mA, VIN=14V, TJ=25°C0.41.0mAMAX mA
Long Term Stability13mV/1000h
Ripple RejectionfO=120H80dB
Dropout VoltageIO=10mA IO=100mA0.05 0.300.2 0.6VMAX
Maximum Operational Input Voltage3326VMIN
Maximum Line TransientRL=500, VO≤ 5.5V, T=1ms,t≤100ms7050VMIN
Reverse Polarity Input Voltage, DCVO≥0.3V, RL=500 ohms30-15VMIN
ReversePolarityInputVoltage,TransientT=1ms, t≤100ms,RL=500 ohms-80-50VMIN
OutputVoltage 6V≤ VIN≤26V, IO=100mA -40°C≤TJ≤125°C55.25 4.75 5.5 4.5VMAX VMIN VMAX VMIN
Line Regulation9V≤ VIN≤16V 6V≤ VIN≤ 26V2 410 30mVMAX
Load Regulation5mA≤ IO≤ 100m1450mVMAX
Output Impedance100mADC and 10mArms 100Hz - 10KHz200
Quiescent CurrentIO≤10mA,6V≤VIN≤26V 40°C≤ TJ≤ 125°C IO=100mA,VIN=14V,TJ=25°C0.41.0 15mAMAX mAMAX
Output Noise Voltage Long Term Stability10Hz-100kHz,COUT=100µF500 20µVrms mV/1000hr
Dropout VoltageIO=10mA IO=100mA0.05 0.300.2 0.6VMAX
Ripple RejectionfO=120Hz80dBMIN
Maximum Operational Input Voltage3326VMIN
Maximum Line TransientRL=500, VO≤ 5.5V, T=1ms,t≤100ms7050VMIN
Reverse Polarity Input Voltage, DCVO≥-0.3V, RL=500 ohms-30-15VMIN
ReversePolarityInputVoltage,TransientT=1ms, t≤100ms,RL=500 ohms-80-50VMIN
Reference Voltage IO≤100mA, 40°C≤Tj≤125°C, R1=27k Measured from VOUT toAdjust Pin1.201.26 1.14 1.32 1.08VMAX VMIN VMAX VMIN
Output Voltage Range24VMAX
Line RegulationVOUT + 0.6V≤ VIN≤ 26V0.21.5mV/VMAX
Load Regulation5mA≤ IO≤100mA0.31%MAX
Output Impedance100mADC and 10mArms, 100Hz–10kHz40mW/V
Quiescent CurrentIO=10mA IO=100mA Durring Shutdown RL=500W0.4 15 0.81 1mAMAX mA mAMAX
Output Noise Voltage10Hz–100kHz100µVrms/V
Long Term Stability0.4%/1000hr
Ripple RejectionfO=120Hz0.02%/V
Dropout VoltageIO≤ 10mA IO=100mA0.05 0.30.2 0.6VMAX VMAX
Maximum Operational Input Voltage3326VMIN
Maximum Line TransientIO=10mA, ReferenceVoltage≤1.5V T=1ms, t≤ 100ms7060VMIN
Reverseolarity Input Voltage, TransientT=1ms, t≤100ms RL=500W-80-50VMIN
On/Off Threshold Voltage On OffVO= 3V 2.0 2.2 1.2 3.25 VMAX VMIN
On/Off Threshold Current2050µAMAX
(NOTE 1) Absolute Maximum Rating sindicate limits beyond which damage to the device may occur. Electrical specifications do not apply when operating the device beyond its rated operating conditions.
(NOTE 2) See circuit in Typical Applications. To ensure constant junction temperature, low duty cycle pulse testing isused.
(NOTE 3) All lmits are guaranteed for TJ=25°C (standard type face) or over the full operating junction temperature range of 40°C to +125°C (bold type face).
(NOTE 4)Human body model, 100pF discharged through 1.5k.

SPICE MODEL
Spice model pending.
 
CROSS REFERENCE PARTS
BayLinear LM2931, Calogic CLM2931, Fairchild Semiconductor LM2931A, Motorola LM2931ACD, National Semiconductor LM2931, ON Semiconductor LM2931, SGS Thomson Microelectronics LM2931AD33, ST Microelectronics LM2931, Wing Shing Computer Components LM2931ACT-5.0

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
mils [mm]
Bonding pads Backside metallization
Silicon 10 73.622 x 56.693 ±1
[1.87 x 1.44]
min 4x4 mils, 1µm thick, aluminium Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.

LM2931 DIE LAYOUT - MECHANICAL SPECIFICATIONSLM2931 DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #FUNCTIONX(mils)X(mm)Y(mils)
1OUTPUT4.3310.113.74
2INPUT4.3310.1148.031
3GND37.5980.95520.669
4SHUTDOWN65.1571.65548.228
5FEEDBACK65.1571.6553.74

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

LM2931 STANDARD PRODUCTS PRICE LIST
USM PART #MINIMUM ORDER QUANTITYWaffle PacksU/P($)
USM LM2931100pc-WP$3.20
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONIX SEMICONDUCTOR technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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