IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

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LIST OF AVAILABLE PACKAGES FCOL-FLIP CHIP ON LEAD FRAME       PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils] MLPM-5FC 5 2X2 63X63 MLPM-6FC 6 3X2 63X102 MLP - MICRO LEADFRAME PACKAGE PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils] MLP Micro 3/5 2x1     3/4/5/6/8 2x2     3/4/5/6/8 3x2     3/4/5/6/8/10 3x3   MLP Quad/Dual - MICRO LEADFRAME PACKAGE PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils] MLP DUAL 6/8/10 3x3     12 4x3     8 (SOIC) 5x6     8/12/16 3 x 3     14 3.5 x 3.5     16 4 x 3.5     12/16/20/24 4 x 4     20 4.5 x 3.5     24 5 x 4     14/20/28/32 5 x 5     38 5 x 7     32 6 x 5     28/36/40 6 x 6     38 7 x 5     32/44/48 7x7     56 8x8     64 9x9   SOT - SMALL OUTLINE TRANSISTOR PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils] SC70-3 3 STD 63X34 SC70-4 4 STD 63X34 SC70-5 5 STD 63X34 SC70-6 6 STD   SC70-8 8 STD   SOT23 3 STD   SOT25 5 STD   SOT26 6 STD   SOT143 4 STD   SC79 2     SC90 3     SOP - SMALL OUTLINE PACKAGE PACKAGE TYPE LEAD COUNT BODY SIZE [mils] DIE SIZE [mils] SOIC 8/14/16 150   SOIC 16/18/20/24/28 300   QSOP 16/20/24/28 150   PACKAGE TYPE LEAD COUNT BODY SIZE [mm] DIE SIZE [mils] SSOP 20/24/28 5.3   TSSOP 8/14/16/20/24/28/38 4.4   TSSOP 48/56 6.1   MSOP 8/10 3.0   PDIP (DIP) - Plastic Dual-In-Line Package PACKAGE TYPE LEAD COUNT BODY SIZE [mils] DIE SIZE [mils] PDIP 8/14/16/24 300   PDIP 48 600   LQFP-LOW QUAD FLAT PACK PACKAGE PACKAGE TYPE LEAD COUNT BODY SIZE mm PITCH mm LQFP-32 32 7X5 0.50 LQFP-32 32 7X7 0.80 LQFP-44 44 10X10 0.80 LQFP-48 48 7X7 0.50 LQFP-52 52 10X10 0.65 LQFP-64 64 7X7 0.40 LQFP-64 64 10X10 0.50 LQFP-64 64 14X14 0.80 LQFP-100 100 14X14 0.50 LQFP-120 120 14X14 0.40 LQFP-128 128 14X14 0.40 LQFP-144 144 20X20 0.50 LQFP-176 176 24X24 0.50 IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.

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