IC Packaging services for Semiconix Semiconductor board level electronic integrated passive networks, integrated circuits and discrete components, resistors, capacitors, inductors, ESD diodes, Schottky diodes, transient surge suppressors, TVS transorb and Zener diodes, include SIP-single in line package,SiP-system in package, PDIP-plastic dual in line package,TO 220 -transistor outline package, MSOP-mini small outline package,MLP-micro leadframe package, MILLIPAQ- micro package, QSOP- quarter size smal outline package,SSBGA-small scale ball grid array-wire bond, SSBGA-FC small scale ball grid array-flip chip, SDBGA-small scale ball grid array-stacked die, SOIC-small outline integrated circuit,SOICW-small outline integrated circuit wide body, SOT-small outline transistor,SSOP-shrink small outline package, TSSOP-thin shrink small outline package, FCOL-flip chip on lead frame-Carsem TM,MQFP-metric quad flat pack, LQFP-low quad flat pack,TQFP-thin quad flat pack, VSOP-very small outline package.
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semiconix semiconductor - where the future is today - gold chip technology PACKAGE OUTLINE INFORMATION
   

GOLD CHIP TECHNOLOGY™
 
LIST OF AVAILABLE PACKAGES SIP - SINGLE INLINE PACKAGE OUTLINE
PDIP - PLASTIC DUAL INLINE PACKAGE SOIC - SMALL OUTLINE INTEGRATED CIRCUIT-150MIL
TO - TRANSISTOR OUTLINE PACKAGE SOICW - SMALL OUTLINE WIDE BODY-300MIL
MSOP - MINI SMALL OUTLINE PACKAGE SOT - SMALL OUTLINE TRANSISTOR PACKAGE
MLP - MICRO LEADFRAME, MICRO LEAD FRAME PACKAGE SSOP - SHRINK SMALL OUTLINE PACKAGE
MILLIPAQ- MICRO PACKAGE TSSOP - THIN SHRINK SMALL OUTLINE PACKAGE
QSOP - QUARTER SIZE SMALL OUTLINE PACKAGE VSOP - VERY SMALL OUTLINE PACKAGE
TQSOP - THIN QUARTER SIZE SMALL OUTLINE PACKAGE FCOL - FLIP CHIP ON LEAD-FRAME
SiP -SYSTEM IN PACKAGE MQFP - METRIC QUAD FLAT PACK PACKAGE
SSBGA - SMALL SCALE BALL GRID ARRAY-WIRE BOND LQFP - LOW QUAD FLAT PACK PACKAGE
SSBGA - FC - SMALL SCALE BALL GRID ARRAY-FLIP CHIP TQFP - THIN QUAD FLAT PACK PACKAGE
SDBGA - SMALL SCALE BALL GRID ARRAY-STACKED DIE SHIPPING PACKAGING DRAWINGS


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