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SMXDS30V0A350 Schottky Diode, 30V, 350mA (LLSD103B) same as MCC Semi LLSD103B manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor
SMXDS30V0A350 Schottky Diode, 30V, 350mA (LLSD103B) same as MCC Semi LLSD103B manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor /images/watermark.gif);background-position: center center;background-repeat: repeat-y;"> REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=SMXDS30V0A350">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXDS30V0A350&c_item_1=Schottky%20Diode,%2030V,%20350mA%20(LLSD103B)">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMXDS30V0A350 - FLIP CHIP GOLD CHIP TECHNOLOGY™ Schottky Diode, 30V, 350mA (LLSD103B) FEATURES APPLICATIONS SCHOTTKY DIODE - FLIP CHIP High reliability Very small conduction losses and switching losses,Fast switching Low forward voltage drop for higher efficiency,Low thermal resistance Unique new design Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Chip on Board System in package SIP Hybrid Circuits Automotive, Biotechnology, Computers, Military, Medical, MEMS, Optoelectronics, Space, Telecommunications Smart Cards, RFID, PDA, Laptops, Mobile phones SMXDS30V0A350 Schottky Diode, 30V, 350mA (LLSD103B) SCHOTTKY DIODES - PRODUCT DESCRIPTION Schottky diodes (also known as hot carrier diodes) are semiconductor diodes with a low forward voltage drop and a very fast switching action, the low forward voltage leading to increased efficiency. While standard silicon diodes have a forward voltage drop of about 0.6 volts, Schottky diodes voltage drop at forward biases of around 1 mA is in the range 0.15 V to 0.46 V, which makes them useful in voltage clamping applications and prevention of transistor saturation, due to the higher current density in the Schottky diode. Schottky diodes are suited for switch mode power supplies and high frequency DC to DC converters. This devices are intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. Due to the small size of the package this device fits many applications. Flip Chip Schottky diode series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ unless otherwise specified VRRM Peak Repetitive Reverse Voltage 30 V VRMS RMS Peak Reverse Voltage 21 V VRWM Working Peak Reverse Voltage 30 V VBRR Repetitive Reverse Breakdown Voltage 30 V IF(AV) Average Rectified Forward Current 350 mA IFSM Forward Surge Current 2 A PD Power Dissipation 400 PDunit TOP Junction Operating Temperature Range -55 +125 °C TSTG Storage Temperature Range -55 +125 °C ELECTRICAL CHARACTERISTICS @25°C unless otherwise specified Symbol Parameter Value Unit Min. Typ. Max VF Forward Voltage @IF=200mA 1 V VBR Maximum DC Blocking Voltage 30 V IR Reverse Leakage Current @VR=20V 5 µA CJ Capacitance (@1.0MHz,) 50 pF tRR Reverse Recovery Time (IF=IR=50mA, IRR = 5mA) 10 ns SPICE MODEL CROSS REFERENCE PARTS: GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon 10±2 0402 Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMXDS30V0A350 MCC Semi LLSD103B Schottky Diode, 30V, 350mA (LLSD103B) SMXDS30V0A350 MCC Semi LLSD103B Schottky Diode, 30V, 350mA (LLSD103B) wire bonding SMXDS30V0A350 MCC Semi LLSD103B Schottky Diode, 30V, 350mA (LLSD103B)thermosonic SMXDS30V0A350 MCC Semi LLSD103B Schottky Diode, 30V, 350mA (LLSD103B)thermal SMXDS30V0A350 MCC Semi LLSD103B Schottky Diode, 30V, 350mA (LLSD103B)solder reflow SMXDS30V0A350 MCC Semi LLSD103B Schottky Diode, 30V, 350mA (LLSD103B) SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMXDS30V0A350-FC -WP 10000 - -FF - - Flip chip SMXDS30V0A350-FC -WP 50000 - -FF - - Gold Bump SMXDS30V0A350-GB -WP 10000 - -FF - - Gold Bump SMXDS30V0A350-GB -WP 50000 - -FF - - Gold-Tin SMXDS30V0A350-GT -WP 10000 - -FF - - Gold-Tin SMXDS30V0A350-GT -WP 50000 - -FF - - Gold/Nickel SMXDS30V0A350-AN -WP 10000 - -FF - - Gold/Nickel SMXDS30V0A350-AN -WP 50000 - -FF - - PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXDS30V0A350&idx=46">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.
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