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SMSSMV30333-05 - BARE DIE |
| GOLD CHIP TECHNOLOGY™ | Single Varactor (Tuning) Diode 13pF |
| FEATURES | APPLICATIONS | VARACTOR DIODE - BARE DIE |
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High reliability bare die Gold metallization RoHS compliant, Lead Free Compatible with chip and wire assemblies Available with top cathode or top anode |
Chip on Board System in package SIP Hybrid Circuits Parametric amplifiers Parametric Oscillators Voltage-controlled oscillators PLL (phase-locked loops) Frequency synthesizers. |
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| VARACTOR DIODES - PRODUCT DESCRIPTION |
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Varicap Diode, Varactor Diode, Variable Capacitance Diode or Tuning Diode is a type of diode which has a variable capacitance that is a function of the voltage impressed on its terminals.
Varactors are operated reverse-biased so no current flows, but since the thickness of the depletion zone varies with the applied bias voltage, the capacitance of the diode can be made to
vary. Generally, the depletion region thickness is proportional to the square root of the applied voltage; and capacitance is inversely proportional to the depletion region thickness.
Thus, the capacitance is inversely proportional to the square root of applied voltage. All diodes exhibit this phenomenon to some degree, but specially made varactor diodes exploit the effect to boost the capacitance and variability range achieved - most diode fabrication attempts to achieve the opposite. Varactors are principally used as a voltage-controlled capacitor, rather than as rectifiers. They are commonly used in parametric amplifiers, parametric oscillators and voltage-controlled oscillators as part of phase-locked loops and frequency synthesizers. Single Varactor Diodes BD series are available in die form in two configurations, Top Cathode XXXX-BD or Top Anode XXXXA-BD. In die form, these products are ideal for high reliability hybrid circuits and multi chip module applications. Common Cathode or Common Anode Varactor Diodes BD series are available in die form in single configuration: Common Cathode in TOP ANODE configuration and Common Anode in TOP CATHODE configuration. |
| HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE |
| COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 |
| DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS |
| Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. |
| Maximum Ratings at TA = 25°C, unless otherwise specified | |||
| Parameter | Symbol | Value | Unit |
| Operating temperature range | Top | -55 to + 125° C | °C |
| Storage temperature | Tstg | -65 to + 150° C | °C |
| Electrical Characteristics at TA= 25°C, unless otherwise specified | ||||||
| Name | Symbol | Test Conditions | Value | Unit | ||
| Min. | Typ. | Max | ||||
| Reverse Breakdown Voltage | V(BR)R | IR=10 µA | 8 | V | ||
| Reverse current | IR1 | VR=6 V | 100 | nA | ||
| Diode capacitance | CT1 | VR=1.65 V f=1MHz | 11 | 14 | pF | |
| Capacitance ratio | C0.3/C1.65 | VR=0.3 V, VR=1.65 V,f=1MHz | 3 | 4 | ||
| Capacitance ratio | C1.65/C3 | VR=1.65 V, VR=3 V,f=1MHz | 3 | 4 | ||
| Capacitance ratio | CT1/CT10 | |||||
| Capacitance ratio | CT2/CT20 | |||||
| Series resistance | rS | f=50MHzVR=4V | 9 | Ω | ||
| SPICE MODEL | ||||||
| Spice model pending. | ||||||
| CROSS REFERENCE PARTS: kNOX SMV30333-08 | ||||||
| GENERAL DIE INFORMATION | ||||||||||||||||||||||
| Substrate | Thickness [mils] |
Die size [mils] |
Bonding pads | Backside metallization | ||||||||||||||||||
| Silicon | 6±1 | 10x20±2 | Pad metal is TiW/Au, 4µm±1 thick, 99.99% electroplated gold with TiW barrier. Custom metallization available upon request. |
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| LAYOUT / DIMENSIONS / PAD LOCATIONS | ||||
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| SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE |
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Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die
attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. |
| STANDARD PRODUCTS ORDERING INFORMATION |
| VERSION | SMS P/N | WAFFLE PACKS | QUANTITY | U/P($) | FILM FRAME | MIN QUANTITY | U/P($) |
| Top cathode | SMSSMV30333-05-BD | -WP | 10000 | -FF | 45000 | ||
| Top cathode | SMSSMV30333-05-BD | -WP | 50000 | -FF | 225000 | ||
| Top anode | SMSSMV30333-05A-BD | -WP | 10000 | -FF | 45000 | ||
| Top anode | SMSSMV30333-05A-BD | -WP | 50000 | -FF | 225000 |
| PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. |
| LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. |
| CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. |
| CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. |
| SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. |
| ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. |
| SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. |
| DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. |
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