SMX LM393 LOW OFFSET VOLTAGE DUAL COMPARATOR same as National Semiconductor LM393, BayLinear LM393, Fairchild Semiconductor LM393, Fairchild Semiconductor LM393N, Fairchild Semiconductor LM393AMX, Fairchild Semiconductor LM393AN, Fairchild Semiconductor LM393AM, Fairchild Semiconductor LM393A, Fairchild Semiconductor LM393MX, Fairchild Semiconductor LM393M, Motorola LM393N, Motorola LM393D, Motorola LM393, National Semiconductor LM393AJ, National Semiconductor LM393AJ, National Semiconductor LM393N, National Semiconductor LM393AH, National Semiconductor LM393AH, National Semiconductor LM393MX, National Semiconductor LM393M, National Semiconductor LM393J, National Semiconductor LM393J, National Semiconductor LM393J, National Semiconductor LM393H, National Semiconductor LM393AH, National Semiconductor LM393 MWC, National Semiconductor LM393AJ, National Semiconductor LM393TLX, National Semiconductor LM393TL, National Semiconductor LM393, ON Semiconductor LM393N, ON Semiconductor LM393, ON Semiconductor LM393DMR2, ON Semiconductor LM393D, ON Semiconductor LM393-D, ON Semiconductor LM393DR2, Philips LM393FE, Philips LM393D, Philips LM393, Philips LM393N, Philips LM393AFE, Philips LM393AN, Philips LM393A, SGS Thomson Microelectronics LM393, SGS Thomson Microelectronics LM393DT, SGS Thomson Microelectronics LM393N, SGS Thomson Microelectronics LM393PT, SGS Thomson Microelectronics LM393D, SGS Thomson Microelectronics LM393, ST Microelectronics LM393ST, ST Microelectronics LM393PT, ST Microelectronics LM393N, ST Microelectronics LM393DT, ST Microelectronics LM393WDT, ST Microelectronics LM393WD, ST Microelectronics LM393W, ST Microelectronics LM393ADT, ST Microelectronics LM393, ST Microelectronics LM393AD, ST Microelectronics LM393D, Texas Instruments LM393ADGKR, Texas Instruments LM393Y, Texas Instruments LM393Y, Texas Instruments LM393Y, Texas Instruments LM393PW, Texas Instruments LM393, Texas Instruments LM393PWLE, Texas Instruments LM393PWR, Texas Instruments LM393AD, Texas Instruments LM393YD, Texas Instruments LM393YD, Texas Instruments LM393YD, Texas Instruments LM393YPW, Texas Instruments LM393YPW, Texas Instruments LM393YP, Texas Instruments LM393YP, Texas Instruments LM393YP, Texas Instruments LM393YJG, Texas Instruments LM393YJG, Texas Instruments LM393YJG, Texas Instruments LM393YFK, Texas Instruments LM393YFK, Texas Instruments LM393YFK, Texas Instruments LM393YPW, Texas Instruments LM393ADR, Texas Instruments LM393PSR, Texas Instruments LM393JG, Texas Instruments LM393JG, Texas Instruments LM393JG, Texas Instruments LM393APW, Texas Instruments LM393APW, Texas Instruments LM393APWR, Texas Instruments LM393FK, Texas Instruments LM393FK, Texas Instruments LM393FK, Texas Instruments LM393D, Texas Instruments LM393DGKR, Texas Instruments LM393DR, Texas Instruments LM393APW, Texas Instruments LM393APSR, Texas Instruments LM393AFK, Texas Instruments LM393AFK, Texas Instruments LM393AFK, Texas Instruments LM393PSLE, Texas Instruments LM393A, Texas Instruments LM393AJG, Texas Instruments LM393AJG, Texas Instruments LM393AJG, Texas Instruments LM393AP, Texas Instruments LM393APWLE, Texas Instruments LM393P, Unisonic Technologies UTCLM393, Wing Shing Computer Components LM393 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. BayLinear LM393, Fairchild Semiconductor LM393, Motorola LM393, National Semiconductor LM393, ON Semiconductor LM393, Philips LM393, SGS Thomson Microelectronics LM393, ST Microelectronics LM393, Texas Instruments LM393, Unisonic Technologies UTCLM393, Wing Shing Computer Components LM393 SMX LM393 LOW OFFSET VOLTAGE DUAL COMPARATOR same as National Semiconductor LM393, BayLinear LM393, Fairchild Semiconductor LM393, Fairchild Semiconductor LM393N, Fairchild Semiconductor LM393AMX, Fairchild Semiconductor LM393AN, Fairchild Semiconductor LM393AM, Fairchild Semiconductor LM393A, Fairchild Semiconductor LM393MX, Fairchild Semiconductor LM393M, Motorola LM393N, Motorola LM393D, Motorola LM393, National Semiconductor LM393AJ, National Semiconductor LM393AJ, National Semiconductor LM393N, National Semiconductor LM393AH, National Semiconductor LM393AH, National Semiconductor LM393MX, National Semiconductor LM393M, National Semiconductor LM393J, National Semiconductor LM393J, National Semiconductor LM393J, National Semiconductor LM393H, National Semiconductor LM393AH, National Semiconductor LM393 MWC, National Semiconductor LM393AJ, National Semiconductor LM393TLX, National Semiconductor LM393TL, National Semiconductor LM393, ON Semiconductor LM393N, ON Semiconductor LM393, ON Semiconductor LM393DMR2, ON Semiconductor LM393D, ON Semiconductor LM393-D, ON Semiconductor LM393DR2, Philips LM393FE, Philips LM393D, Philips LM393, Philips LM393N, Philips LM393AFE, Philips LM393AN, Philips LM393A, SGS Thomson Microelectronics LM393, SGS Thomson Microelectronics LM393DT, SGS Thomson Microelectronics LM393N, SGS Thomson Microelectronics LM393PT, SGS Thomson Microelectronics LM393D, SGS Thomson Microelectronics LM393, ST Microelectronics LM393ST, ST Microelectronics LM393PT, ST Microelectronics LM393N, ST Microelectronics LM393DT, ST Microelectronics LM393WDT, ST Microelectronics LM393WD, ST Microelectronics LM393W, ST Microelectronics LM393ADT, ST Microelectronics LM393, ST Microelectronics LM393AD, ST Microelectronics LM393D, Texas Instruments LM393ADGKR, Texas Instruments LM393Y, Texas Instruments LM393Y, Texas Instruments LM393Y, Texas Instruments LM393PW, Texas Instruments LM393, Texas Instruments LM393PWLE, Texas Instruments LM393PWR, Texas Instruments LM393AD, Texas Instruments LM393YD, Texas Instruments LM393YD, Texas Instruments LM393YD, Texas Instruments LM393YPW, Texas Instruments LM393YPW, Texas Instruments LM393YP, Texas Instruments LM393YP, Texas Instruments LM393YP, Texas Instruments LM393YJG, Texas Instruments LM393YJG, Texas Instruments LM393YJG, Texas Instruments LM393YFK, Texas Instruments LM393YFK, Texas Instruments LM393YFK, Texas Instruments LM393YPW, Texas Instruments LM393ADR, Texas Instruments LM393PSR, Texas Instruments LM393JG, Texas Instruments LM393JG, Texas Instruments LM393JG, Texas Instruments LM393APW, Texas Instruments LM393APW, Texas Instruments LM393APWR, Texas Instruments LM393FK, Texas Instruments LM393FK, Texas Instruments LM393FK, Texas Instruments LM393D, Texas Instruments LM393DGKR, Texas Instruments LM393DR, Texas Instruments LM393APW, Texas Instruments LM393APSR, Texas Instruments LM393AFK, Texas Instruments LM393AFK, Texas Instruments LM393AFK, Texas Instruments LM393PSLE, Texas Instruments LM393A, Texas Instruments LM393AJG, Texas Instruments LM393AJG, Texas Instruments LM393AJG, Texas Instruments LM393AP, Texas Instruments LM393APWLE, Texas Instruments LM393P, Unisonic Technologies UTCLM393, Wing Shing Computer Components LM393 manufactured by Semiconix Semiconductor - Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor - Goldchip technology is trademark of Semiconix Corporation for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. BayLinear LM393, Fairchild Semiconductor LM393, Motorola LM393, National Semiconductor LM393, ON Semiconductor LM393, Philips LM393, SGS Thomson Microelectronics LM393, ST Microelectronics LM393, Texas Instruments LM393, Unisonic Technologies UTCLM393, Wing Shing Computer Components LM393 REGISTER-LOGIN PRODUCTS CROSS REFERENCE /cgi-bin/stock.pl?part=LM393">INVENTORY /cgi-bin/rfq.cgi?site=4&rows=1&item_1=SMXLM393&c_item_1=">REQUEST QUOTE smxrootwww.semiconix.com/cgi-bin/order.cgi?site=">ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMX LM393 - BARE DIE GOLD CHIP TECHNOLOGY™ LOW OFFSET VOLTAGE DUAL COMPARATOR FEATURES APPLICATIONS LOW OFFSET VOLTAGE DUAL COMPARATOR Wide single supply 2.0V to 36V Dual supplies:±1.0V to ±18V Very low supply current drain (0.4 mA) independent of supply voltage In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS LM393 LM393 LOW OFFSET VOLTAGE DUAL COMPARATOR SMXLM393 LOW OFFSET VOLTAGE DUAL COMPARATOR - PRODUCT DESCRIPTION The SMX LM393 series are dual independent precision voltage comparators capable of single or split power supply operation. These devices are designed to permit a common mode range to ground level with single supply operation. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions. SCHEMATIC DIAGRAM LM393 National Semiconductor LM393 LOW OFFSET VOLTAGE DUAL COMPARATOR LM393 MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNITS Power Supply Voltages VCC +36 or ±18 Vdc Input Differential Voltage Range Vdir 32 Vdc Input Common Mode Voltage Range Vicr -0.3 to +36 Vdc Output Short Circuit to Ground Output Sink Current (Note 1) Isc Isink Continuous 20 mA Power Dissipation TA=25 °C Derate above 25°C PD 1/RthJA 570 5.7 mW mW/°C Operating Ambient Temperature Range Top -25 to +85 °C Maximum Operating Junction Temperature Tj(max) 125 °C Storage Temperature Range Tstg -65 to 150 °C ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. LM393 ELECTRICAL CHARACTERISTIC VCC=5.0Vdc, Tlow<TA<Thigh,unless otherwise noted PARAMETER TEST CONDITIONS SYMBOL MIN TYP MAX UNITS Input Offset Voltage(Note2) TA=25°C VIO ±1.0 ±5.0 mV Input Offset Voltage(Note2) TLow<TA<Thigh 9 mV Input Bias Current TA=25°C ±5.0 ±50 nA Input Common Mode Voltage Range (Note 4) TLow<TA<Thigh ±150 nA Voltage Gain RL≥15kW, VCC=15Vdc, TA=25°C 50 200 V/mV Large Signal Response Time Vin=TTL Logic Swing, Vref=1.4 Vdc VRL=5.0 Vdc, RL=5.1kW, TA=25°C 300 ns Response Time(Note5) VRL=5.0 Vdc, RL=5.1kW, TA=25°C 1.3 µs Input Differential Voltage (Note 6) Vin≥ GND or V– Supply (if used) VCC V Output Sink Current Vin≥1.0Vdc, Vin+=0Vdc, VO<1.5Vdc 6 16 mA Output Saturation Voltage TLow<TA<ThighVin≥1.0 Vdc, Vin+=0 Vdc, ISink<4.0mA 150 - 400 700 *Tlow=0°C, Thigh=+70°C (NOTE 1)The maximum output current may be as high as 20 mA, independent of the magnitude of VCC, output short circuits to VCC can cause excessive heating and eventual destruction. (NOTE 2)At output switch point, VO= 1.4 Vdc, RS=0 with VCC from 5.0 Vdc to 30 Vdc, and over the full input common mode range (0 V to V=–1.5 V). (NOTE 3)Due to the PNP transistor inputs, bias current will flow out of the inputs. This current is essentially constant, independent of the output state, there fore, no loading changes will exist on the input lines. (NOTE 4)Input common mode of either input should not be permitted to go more than 0.3 V negative of ground or minus supply. The upper limit of common mode range is V CC–1.5 V. (NOTE 5)5.Response time is specified with a 100 mV step and 5.0 mV of overdrive. With larger magnitudes of overdrive faster response times are obtainable. (NOTE 6)The comparator will exhibit proper output state if one of the inputs becomes greater than Vrange. The low input state must not be less than –0.3 V of ground or minus supply. SPICE MODEL CROSS REFERENCE PARTS GENERAL DIE INFORMATION Substrate Thickness [mils] Die size mils [mm] Bonding pads Backside metallization Silicon 10 51.181 x 47.244 ±1 [1.3 x 1.2] 4.724x4.724 Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach. LM393 DIE LAYOUT - MECHANICAL SPECIFICATIONS LM393 DIE LAYOUT - MECHANICAL SPECIFICATIONS PAD # FUNCTION X(mils) X(mm) Y(mils) 1 #1 OUT 42.322 1.075 36.322 2 #1 IN- 25.393 0.645 37.972 3 #1 IN+ 9.448 0.24 37.972 4 GND 3.937 0.1 21.062 5 #2 IN+ 9.448 0.24 3.937 6 #2 IN- 25.393 0.645 3.937 7 #2 OUT 42.322 1.075 5.905 8 VCC 42.322 1.075 20.866 SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. LM393 STANDARD PRODUCTS PRICE LIST USM PART # MINIMUM ORDER QUANTITY Waffle Packs U/P($) USMLM393 100pc -WP $3.20 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. /cgi-bin/rfq.cgi" method="post" target="new"> INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES /cgi-bin/getpdf.pl?part=SMXLM393&idx=11">PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated: Display settings for best viewing: Current display settings: Page hits: Screen resolution: 1124x864 Screen resolution: Total site visits: Color quality: 16 bit Color quality: bit © 1990- SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission. Valid XHTML 1.0 Transitional by http://validator.w3.org

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semiconix semiconductor - where the future is today - gold chip technology SMX LM393 - BARE DIE
GOLD CHIP TECHNOLOGY™ LOW OFFSET VOLTAGE DUAL COMPARATOR

FEATURES APPLICATIONS LOW OFFSET VOLTAGE DUAL COMPARATOR
Wide single supply 2.0V to 36V
Dual supplies:±1.0V to ±18V
Very low supply current drain (0.4 mA) independent of supply voltage






In DIE form, this device is an excellent selection for many chip and wire HYBRID CIRCUITS









LM393 LM393 LOW OFFSET VOLTAGE DUAL COMPARATOR

SMXLM393 LOW OFFSET VOLTAGE DUAL COMPARATOR - PRODUCT DESCRIPTION
The SMX LM393 series are dual independent precision voltage comparators capable of single or split power supply operation. These devices are designed to permit a common mode range to ground level with single supply operation.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

SEMICONDUCTOR INTEGRATED CIRCUITS MANUFACTURING PROCESS
Semiconductor Integrated Circuits are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with other semiconductor devices on same chip to obtain standard and custom complex device solutions.


SCHEMATIC DIAGRAM
LM393 National Semiconductor LM393 LOW OFFSET VOLTAGE DUAL COMPARATOR

LM393 MAXIMUM RATINGS
PARAMETERSYMBOLVALUEUNITS
Power Supply VoltagesVCC+36 or ±18Vdc
Input Differential Voltage RangeVdir32Vdc
Input Common Mode Voltage RangeVicr-0.3 to +36Vdc
Output Short Circuit to Ground Output Sink Current (Note 1)Isc IsinkContinuous 20mA
Power Dissipation TA=25 °C Derate above 25°CPD 1/RthJA570 5.7mW mW/°C
Operating Ambient Temperature RangeTop-25 to +85°C
Maximum Operating Junction TemperatureTj(max)125°C
Storage Temperature RangeTstg-65 to 150°C
ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

LM393 ELECTRICAL CHARACTERISTIC
VCC=5.0Vdc, Tlow<TA<Thigh,unless otherwise noted
PARAMETERTEST CONDITIONSSYMBOLMINTYPMAXUNITS
Input Offset Voltage(Note2)TA=25°CVIO±1.0±5.0mV
Input Offset Voltage(Note2)TLow<TA<Thigh9mV
Input Bias CurrentTA=25°C±5.0±50nA
Input Common Mode Voltage Range (Note 4)TLow<TA<Thigh±150nA
Voltage GainRL≥15kW, VCC=15Vdc, TA=25°C50200V/mV
Large Signal Response TimeVin=TTL Logic Swing, Vref=1.4 Vdc VRL=5.0 Vdc, RL=5.1kW, TA=25°C300ns
Response Time(Note5)VRL=5.0 Vdc, RL=5.1kW, TA=25°C1.3µs
Input Differential Voltage (Note 6)Vin≥ GND or V– Supply (if used)VCCV
Output Sink CurrentVin≥1.0Vdc, Vin+=0Vdc, VO<1.5Vdc616mA
Output Saturation VoltageTLow<TA<ThighVin≥1.0 Vdc, Vin+=0 Vdc, ISink<4.0mA150 -400 700
*Tlow=0°C, Thigh=+70°C
(NOTE 1)The maximum output current may be as high as 20 mA, independent of the magnitude of VCC, output short circuits to VCC can cause excessive heating and eventual destruction.
(NOTE 2)At output switch point, VO= 1.4 Vdc, RS=0 with VCC from 5.0 Vdc to 30 Vdc, and over the full input common mode range (0 V to V=–1.5 V).
(NOTE 3)Due to the PNP transistor inputs, bias current will flow out of the inputs. This current is essentially constant, independent of the output state, there fore, no loading changes will exist on the input lines.
(NOTE 4)Input common mode of either input should not be permitted to go more than 0.3 V negative of ground or minus supply. The upper limit of common mode range is V CC–1.5 V.
(NOTE 5)5.Response time is specified with a 100 mV step and 5.0 mV of overdrive. With larger magnitudes of overdrive faster response times are obtainable.
(NOTE 6)The comparator will exhibit proper output state if one of the inputs becomes greater than Vrange. The low input state must not be less than –0.3 V of ground or minus supply.

SPICE MODEL
Spice model pending.
 
CROSS REFERENCE PARTS
BayLinear LM393, Fairchild Semiconductor LM393, Motorola LM393, National Semiconductor LM393, ON Semiconductor LM393, Philips LM393, SGS Thomson Microelectronics LM393, ST Microelectronics LM393, Texas Instruments LM393, Unisonic Technologies UTCLM393, Wing Shing Computer Components LM393

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
mils [mm]
Bonding pads Backside metallization
Silicon 10 51.181 x 47.244 ±1
[1.3 x 1.2]
4.724x4.724 Backside of the die is coated with 0.5µm GOLD , which makes it compatible with AuSi or AuGe die attach.

LM393 DIE LAYOUT - MECHANICAL SPECIFICATIONSLM393 DIE LAYOUT - MECHANICAL SPECIFICATIONS
PAD #FUNCTIONX(mils)X(mm)Y(mils)
1#1 OUT42.3221.07536.322
2#1 IN-25.3930.64537.972
3#1 IN+9.4480.2437.972
4GND3.9370.121.062
5#2 IN+9.4480.243.937
6#2 IN-25.3930.6453.937
7#2 OUT42.3221.0755.905
8VCC42.3221.07520.866

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

LM393 STANDARD PRODUCTS PRICE LIST
USM PART #MINIMUM ORDER QUANTITYWaffle PacksU/P($)
USMLM393100pc-WP$3.20
Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department.
List prices are for standard products, available from stock. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order. For custom products please inquire by contacting SEMICONIX SEMICONDUCTOR technical sales. No rights can be derived from pricing information provided on this website. Such information is indicative only, is showed for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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