Low Drop Voltage Regulators: SMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD TO263-3L AMS Advanced Monolithic Systems AMS1085CD manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD TO263-3L AMS Advanced Monolithic Systems AMS1085CD manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO263-3L AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD AMS Advanced Monolithic Systems AMS1085CD,SMS1085CD,3A Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Low Drop Voltage Regulators: SMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD TO263-3L AMS Advanced Monolithic Systems AMS1085CD manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR same as AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD TO263-3L AMS Advanced Monolithic Systems AMS1085CD manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO263-3L AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD AMS Advanced Monolithic Systems AMS1085CD,SMS1085CD,3A Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS1085CD - BARE DIE GOLD CHIP TECHNOLOGY™ 3A LOW DROPOUT VOLTAGE REGULATOR FEATURES APPLICATIONS 3A Low Drop Voltage Regulators - BARE DIE Three Terminal Adjustable or Fixed Output Current of 10A Operates Down to 1V Dropout Line Regulation: 0.015% Load Regulation: 0.1% Load Regulation: 0.1% Available in TO220-3Lpackage. High reliability bare die Gold metallization RoHS compliant, Lead Free Compatible with chip and wire assemblies High Efficiency Linear Regulators Post Regulators for Switching Supplies Microprocessor Supply Battery Chargers Constant Current Regulators Notebook/Personal Computer Supplies Portable Instrumentation Chip on Board System in package SIP Hybrid Circuits SMS1085CD AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR Actual die layout may vary 3A LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION SMS1085 series of adjustable and fixed voltage regulators are designed to provide 3A output current and to operate down to 1V input-TOoutput differential. The dropout voltage of the device is guaranteed maximum 1.5V at maximum output current, decreasing at lower load currents. On-chip trimming adjusts the reference voltage to 1%. Current limit is also trimmed, minimizing the stress under overload conditions on both the regulator and power source circuitry. The SMS1085 devices are pin compatible with older three-terminal regulators and are offered in 3 lead TO220, 3 lead TO263 (Plastic DD) and TO252 (DPAK) packages. Low Drop Voltage Regulators Integrated Circuits BD series products available in die form are ideal for high reliability hybrid circuits and multi chip module applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Power Dissipation Internally limited Input Voltage 15 V Storage Temperature -65 to +150 °C Control Section 0° C to 125 °C Power Transistor 0° C to 150 ° C Electrical Characteristics* at IOUT=0 mA, TC=25°C unless otherwise noted Name Symbol Test Conditions Value Unit Min. Typ. Max Reference Voltage (Note 2) IOUT=10 mA 1.238 1.25 1.262 V Reference Voltage over the full operating temperature range. 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 1.225 1.25 1.27 V Line Regulation ILOAD=10 mA, 1.5V≤ (VIN - VOUT)≤12V 0.3 6 mV Line Regulation, over the full operating temperature range. ILOAD=10 mA, 1.5V≤ (VIN - VOUT)≤12V 0.6 10 mV Load Regulation, (Notes 2, 3) (VIN - VOUT)=3V, 10mA≤IOUT≤3A 0.1 0.3 % Load Regulation, over the full operating temperature range. (VIN - VOUT)=3V, 10mA≤IOUT≤3A 0.2 0.4 % Dropout Voltage (VIN - VOUT) ∆VOUT, ∆VREF=1%, IOUT=3 A (Note 4) 1.3 1.5 V Current Limit (VIN - VOUT)=5V 3 3.5 4 A Minimum Load Current (VIN - VOUT)=12V (Note 5) 5 10 mA Quiescent Current VIN≤12V 5 10 mA Ripple Rejection f=120Hz, COUT=25µF Tantalum, IOUT=3A, (VIN-VOUT )=3V, CADJ=25µF 60 75 dB Thermal Regulation TA=25°C, 30ms pulse 0.008 0.04 %W Adjust Pin Current 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 55 m A Adjust Pin Current, over the full operating temperature range. 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 120 m A Adjust Pin Current Change 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 0.2 5 m A Temperature Stability 0.5 % Long Term Stability TA=125°C, 1000Hrs 0.3 1 % RMS Output Noise (% of VOUT ) TA=25°C, 10Hz≤f≤10kHz 0.003 % Thermal Resistance Junction-to-Case M Package: Control Circuitry/ Power Transistor 1.5/4.0 °C/W Thermal Resistance Junction-to-Case T Package: Control Circuitry/ Power Transistor 1.5/4.0 °C/W Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Note 2: Line and Load regulation are guaranteed up to the maximum power dissipation of 15W. Power dissipation is determined by the input/output differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range. Note 3:See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction temperature by low duty cycle pulse testing. Load regulation is measured at the output lead ~1/8” from the package. Note 4: Dropout voltage is specified over the full output current range of the device. Note 5: Minimum load current is defined as the minimum output current required to maintain regulation. When (VIN - VOUT) = 12V the device is guaranteed to regulate if the output current is greater than 10mA. SPICE MODEL AMS1085CD spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD GENERAL DIE INFORMATION Substrate Thickness [mils] Die size [mils] Bonding pads Backside metallization Silicon Si 10 1 122x130±1 [3.1x3.3±0.025] Pads are minimum 4x4mils, 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion. P/N Metal Die attach process -BD0 Au/Si Au/Si eutectic -BD1 Ti/Pd/Au AuSn,AuGe -BD2 Ti/Pt/Au AuSn,AuGe -BD3 Ti/Ni/Au Soft Solder SAC -BD4 Ti/Pt/AuSn AuSn eutectic LAYOUT / DIMENSIONS / PAD LOCATIONS Actual die layout may vary SMS1085CD AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD AMS Advanced Monolithic Systems AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR SMS1085CD AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR Pad locations Pin # Function X [µm] Y [µm] X [mils] Y [mils] 1 Vin 1535 1286 60.43 50.63 2 Vin 1535 2727 60.43 107.36 3 Vout 419 2014 16.50 79.29 4 Vout 2589 2014 101.93 79.29 5 ADJ 279 899 10.98 35.39 SMS1085CD AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD AMS Advanced Monolithic Systems AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR APPLICATION HINTS APPLICATION HINTS The SMS1085 series of adjustable and fixed regulators are easy to use and have all the protection features expected in high performance voltage regulators: short circuit protection and thermal shutdown. Pin compatible with older three terminal adjustable regulators, these devices offer the advantage of a lower dropout voltage, more precise reference tolerance and improved reference stability with temperature. Stability The circuit design used in the SMS1085 series requires the use of an output capacitor as part of the device frequency compensation. The addition of 150µF aluminum electrolytic or a 22µF solid tantalum on the output will ensure stability for all operating conditions. When the adjustment terminal is bypassed to improve the ripple rejection, the requirement for an output capacitor increases. The value of 22µF tantalum or 150µF aluminum covers all cases of bypassing the adjustment terminal. Without bypassing the adjustment terminal smaller capacitors can be used with equally good results. To ensure good transient response with heavy load current changes capacitor values on the order of 100µF are used in the output of many regulators. To further improve stability and transient response of these devices larger values of output capacitor can be used. Protection Diodes Unlike older regulators, the SMS1085 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent over-stressing the die. Internal resistors are limiting the internal current paths on the SMS1085 adjustment pin, therefore even with capacitors on the adjustment pin no protection diode is needed to ensure device safety under short-circuit conditions. Diodes between the input and output are not usually needed. Microsecond surge currents of 50A to 100A can be handled by the internal diode between the input and output pins of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000µF to 5000µF and the input pin is instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the SMS1085 is used. Normal power supply cycling or even plugging and unplugging in the system will not generate current large enough to do any damage. The adjustment pin can be driven on a transient basis ±25V, with respect to the output without any device degradation. As with any IC regulator, none the protection circuitry will be functional and the internal transistors will break down if the maximum input to output voltage differential is exceeded. Overload Recovery When the power is first turned on, as the input voltage rises, the output follows the input, permitting the regulator to start up into heavy loads. During the start-up, as the input voltage is rising, the input-to-output voltage differential remains small, allowing the regulator to supply large output currents. A problem can occur with a heavy output load when the input voltage is high and the output voltage is low, when the removal of an output short will not permit the output voltage to recover. The load line for such a load may intersect two points on the output current curve. In this case, there are two stable output operating points for the regulator. With this double intersection, the power supply may need to be cycled down to zero and brought up again to make the output recover. Ripple Rejection The ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally 100. to120.) for a proper bypassing and ripple rejection approaching the values shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100. at 120Hz the adjust pin capacitor should be 25µF. At 10kHz only 0.22µF is needed. The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (VOUT / VREF ). Output Voltage The SMS1085 series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. This current is normally the specified minimum load current of 10mA. Because IADJ is very small and constant it represents a small error and it can usually be ignored. VOUT = VREF (1+ R2/R1)+IADJR2 Load Regulation True remote load sensing it is not possible to provide, because the SMS1085 is a three terminal device. The resistance of the wire connecting the regulator to the load will limit the load regulation. The data sheet specification for load regulation is measured at the bottom of the package. Negative side sensing is a true Kelvin connection, with the bottom of the output divider returned to the negative side of the load. The best load regulation is obtained when the top of the resistor divider R1 is connected directly to the case not to the load. If R1 were connected to the load, the effective resistance between the regulator and the load would be: RP x ( R2+R1 ) , RP = Parasitic Line Resistance *CONNECT R1 TO CASE, CONNECT R2 TO LOAD Connected as shown, RP is not multiplied by the divider ratio. Using 16-gauge wire the parasitic line resistance is about 0.004. per foot, translating to 4mV/ft at 1A load current. It is important to keep the positive lead between regulator and load as short as possible and use large wire or PC board traces. Thermal Considerations The SMS1085 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load conditions. Careful consideration must be given to all sources of thermal resistance from junction to ambient, including junction-to-case, case-to-heat sink interface and heat sink resistance itself. To ensure safe operating temperatures and reflect more accurately the device temperature, new thermal resistance specifications have been developed. Unlike older regulators with a single junction-to-case thermal resistance specification, the data section for these new regulators provides a separate thermal resistance and maximum junction temperature for both the Control Section and the Power Transistor. Calculations for both temperatures under certain conditions of ambient temperature and heat sink resistance and to ensure that both thermal limits are met. Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for the heat flow. In order to ensure the best possible thermal flow from this area of the package to the heat sink proper mounting is required. Thermal compound at the case-to-heat sink interface is recommended. A thermally conductive spacer can be used, if the case of the device must be electrically isolated, but its added contribution to thermal resistance has to be considered. Vout Basic Adjustable Regulator Figure 1: Vout Basic Adjustable Regulator Protection diodes Figure 2: Protection diodes Connections for Best Load Regulation Figure 3: Connections for Best Load Regulation SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization. For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au. For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used. In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended. IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000. STANDARD PRODUCTS ORDERING INFORMATION SMS P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) SMS1085CD-BD -WP 1000 -FF 1000 SMS1085CD-BD -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMS1085CD - BARE DIE
GOLD CHIP TECHNOLOGY™ 3A LOW DROPOUT VOLTAGE REGULATOR

FEATURES APPLICATIONS 3A Low Drop Voltage Regulators - BARE DIE
Three Terminal Adjustable or Fixed
Output Current of 10A
Operates Down to 1V Dropout
Line Regulation: 0.015%
Load Regulation: 0.1%
Load Regulation: 0.1%
Available in TO220-3Lpackage.
High reliability bare die
Gold metallization
RoHS compliant, Lead Free
Compatible with chip and wire assemblies
High Efficiency Linear Regulators
Post Regulators for Switching Supplies
Microprocessor Supply
Battery Chargers
Constant Current Regulators
Notebook/Personal Computer Supplies
Portable Instrumentation
Chip on Board
System in package SIP
Hybrid Circuits
SMS1085CD AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR
Actual die layout may vary

3A LOW DROPOUT VOLTAGE REGULATOR - PRODUCT DESCRIPTION
SMS1085 series of adjustable and fixed voltage regulators are designed to provide 3A output current and to operate down to 1V input-TOoutput differential. The dropout voltage of the device is guaranteed maximum 1.5V at maximum output current, decreasing at lower load currents. On-chip trimming adjusts the reference voltage to 1%. Current limit is also trimmed, minimizing the stress under overload conditions on both the regulator and power source circuitry. The SMS1085 devices are pin compatible with older three-terminal regulators and are offered in 3 lead TO220, 3 lead TO263 (Plastic DD) and TO252 (DPAK) packages.
Low Drop Voltage Regulators Integrated Circuits BD series products available in die form are ideal for high reliability hybrid circuits and multi chip module applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Power Dissipation Internally limited
Input Voltage 15 V
Storage Temperature -65 to +150 °C
Control Section 0° C to 125 °C
Power Transistor 0° C to 150 ° C

Electrical Characteristics* at IOUT=0 mA, TC=25°C unless otherwise noted
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Reference Voltage (Note 2) IOUT=10 mA 1.238 1.25 1.262 V
Reference Voltage over the full operating temperature range. 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 1.225 1.25 1.27 V
Line Regulation ILOAD=10 mA, 1.5V≤ (VIN - VOUT)≤12V 0.3 6 mV
Line Regulation, over the full operating temperature range. ILOAD=10 mA, 1.5V≤ (VIN - VOUT)≤12V 0.6 10 mV
Load Regulation, (Notes 2, 3) (VIN - VOUT)=3V, 10mA≤IOUT≤3A 0.1 0.3 %
Load Regulation, over the full operating temperature range. (VIN - VOUT)=3V, 10mA≤IOUT≤3A 0.2 0.4 %
Dropout Voltage (VIN - VOUT) ∆VOUT, ∆VREF=1%, IOUT=3 A (Note 4) 1.3 1.5 V
Current Limit (VIN - VOUT)=5V 3 3.5 4 A
Minimum Load Current (VIN - VOUT)=12V (Note 5) 5 10 mA
Quiescent Current VIN≤12V 5 10 mA
Ripple Rejection f=120Hz, COUT=25µF Tantalum, IOUT=3A, (VIN-VOUT )=3V, CADJ=25µF 60 75 dB
Thermal Regulation TA=25°C, 30ms pulse 0.008 0.04 %W
Adjust Pin Current 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 55 m A
Adjust Pin Current, over the full operating temperature range. 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 120 m A
Adjust Pin Current Change 10mA≤IOUT≤3A, 1.5V≤ (VIN - VOUT)≤12V 0.2 5 m A
Temperature Stability 0.5 %
Long Term Stability TA=125°C, 1000Hrs 0.3 1 %
RMS Output Noise (% of VOUT ) TA=25°C, 10Hz≤f≤10kHz 0.003 %
Thermal Resistance Junction-to-Case M Package: Control Circuitry/ Power Transistor 1.5/4.0 °C/W
Thermal Resistance Junction-to-Case T Package: Control Circuitry/ Power Transistor 1.5/4.0 °C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the
Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
Note 2: Line and Load regulation are guaranteed up to the maximum power dissipation of 15W. Power dissipation is determined by the input/output
differential and the output current. Guaranteed maximum power dissipation will not be available over the full input/output range.
Note 3:See thermal regulation specifications for changes in output voltage due to heating effects. Line and load regulation are measured at a constant junction
temperature by low duty cycle pulse testing. Load regulation is measured at the output lead ~1/8” from the package.
Note 4: Dropout voltage is specified over the full output current range of the device.
Note 5: Minimum load current is defined as the minimum output current required to maintain regulation. When (VIN - VOUT) = 12V the device is guaranteed
to regulate if the output current is greater than 10mA.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Die size
[mils]
Bonding pads Backside metallization
Silicon
Si
10 1 122x130±1
[3.1x3.3±0.025]
Pads are minimum 4x4mils, 3µm thick, 99.99% electroplated gold with a TiW barrier that withstands 30 min at 400°C in air without loss of adhesion.
P/N MetalDie attach process
-BD0Au/SiAu/Si eutectic
-BD1Ti/Pd/AuAuSn,AuGe
-BD2Ti/Pt/AuAuSn,AuGe
-BD3Ti/Ni/AuSoft Solder SAC
-BD4Ti/Pt/AuSnAuSn eutectic

LAYOUT / DIMENSIONS / PAD LOCATIONS
Actual die layout may vary
SMS1085CD AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD AMS Advanced Monolithic Systems AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR SMS1085CD AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR
Pad locations
Pin # Function X [µm] Y [µm] X [mils] Y [mils]
1 Vin 1535 1286 60.43 50.63
2 Vin 1535 2727 60.43 107.36
3 Vout 419 2014 16.50 79.29
4 Vout 2589 2014 101.93 79.29
5 ADJ 279 899 10.98 35.39
SMS1085CD AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD, AMS Advanced Monolithic Systems AMS1085CD AMS Advanced Monolithic Systems AMS1085CD 3A LOW DROPOUT VOLTAGE REGULATOR

APPLICATION HINTS

APPLICATION HINTS 


The SMS1085 series of adjustable and fixed regulators are easy to use and have all the protection features expected in high performance voltage regulators: short circuit protection and thermal shutdown.
Pin compatible with older three terminal adjustable regulators, these devices offer the advantage of a lower dropout voltage, more precise reference tolerance and improved reference stability with temperature.

Stability
The circuit design used in the SMS1085 series requires the use of an output capacitor as part of the device frequency compensation. The addition of 150µF aluminum electrolytic or a 22µF solid tantalum on the output will ensure stability for all operating conditions.
When the adjustment terminal is bypassed to improve the ripple rejection, the requirement for an output capacitor increases. The value of 22µF tantalum or 150µF aluminum covers all cases of bypassing the adjustment terminal. Without bypassing the adjustment terminal smaller capacitors can be used with equally good results.
To ensure good transient response with heavy load current changes capacitor values on the order of 100µF are used in the output of many regulators. To further improve stability and transient response of these devices larger values of output capacitor can be used.

Protection Diodes
Unlike older regulators, the SMS1085 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent over-stressing the die. Internal resistors are limiting the internal current paths on the SMS1085 adjustment pin, therefore even with capacitors on the adjustment pin no protection diode is needed to ensure device safety under short-circuit conditions.
Diodes between the input and output are not usually needed. Microsecond surge currents of 50A to 100A can be handled by the internal diode between the input and output pins of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000µF to 5000µF and the input pin is instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the SMS1085 is used. Normal power supply cycling or even plugging and unplugging in the system will not generate current large enough to do any damage. The adjustment pin can be driven on a transient basis ±25V, with respect to the output without any device degradation. As with any IC regulator, none the protection circuitry will be functional and the internal transistors will break down if the maximum input to output voltage differential is exceeded.

Overload Recovery
When the power is first turned on, as the input voltage rises, the output follows the input, permitting the regulator to start up into heavy loads. During the start-up, as the input voltage is rising, the input-to-output voltage differential remains small, allowing the regulator to supply large output currents. A problem can occur with a heavy output load when the input voltage is high and the output voltage is low, when the removal of an output short will not permit the output voltage to recover. The load line for such a load may intersect two points on the output current curve. In this case, there are two stable output operating points for the regulator. With this double intersection, the power supply may need to be cycled down to zero and brought up again to make the output recover.

Ripple Rejection
The ripple rejection values are measured with the adjustment pin bypassed. The impedance of the adjust pin capacitor at the ripple frequency should be less than the value of R1 (normally 100. to120.) for a proper bypassing and ripple rejection approaching the values shown. The size of the required adjust pin capacitor is a function of the input ripple frequency. If R1=100. at 120Hz the adjust pin capacitor should be 25µF. At 10kHz only 0.22µF is needed.
The ripple rejection will be a function of output voltage, in circuits without an adjust pin bypass capacitor. The output ripple will increase directly as a ratio of the output voltage to the reference voltage (VOUT / VREF ).

Output Voltage
The SMS1085 series develops a 1.25V reference voltage between the output and the adjust terminal. Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage.
This current is normally the specified minimum load current of 10mA. Because IADJ is very small and constant it represents a small error and it can usually be ignored.
VOUT = VREF (1+ R2/R1)+IADJR2

Load Regulation

True remote load sensing it is not possible to provide, because the SMS1085 is a three terminal device. The resistance of the wire connecting the regulator to the load will limit the load regulation. The data sheet specification for load regulation is measured at the bottom of the package. Negative side sensing is a true Kelvin connection, with the bottom of the output divider returned to the negative side of the load.
The best load regulation is obtained when the top of the resistor divider R1 is connected directly to the case not to the load. If R1 were connected to the load, the effective resistance between the regulator and the load would be:
RP x ( R2+R1 ) , RP = Parasitic Line Resistance
*CONNECT R1 TO CASE, CONNECT R2 TO LOAD
Connected as shown, RP is not multiplied by the divider ratio. Using 16-gauge wire the parasitic line resistance is about 0.004. per foot, translating to 4mV/ft at 1A load current. It is important to keep the positive lead between regulator and load as short as possible and use large wire or PC board traces.

Thermal Considerations

The SMS1085 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load conditions. Careful consideration must be given to all sources of thermal resistance from junction to ambient, including junction-to-case, case-to-heat sink interface and heat sink resistance itself. To ensure safe operating temperatures and reflect more accurately the device temperature, new thermal resistance specifications have been developed. Unlike older regulators with a single junction-to-case thermal resistance specification, the data section for these new regulators provides a separate thermal resistance and maximum junction temperature for both the Control Section and the Power Transistor. Calculations for both temperatures under certain conditions of ambient temperature and heat sink resistance and to ensure that both thermal limits are met.
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for the heat flow. In order to ensure the best possible thermal flow from this area of the package to the heat sink proper mounting is required. Thermal compound at the case-to-heat sink interface is recommended. A thermally conductive spacer can be used, if the case of the device must be electrically isolated, but its added contribution to thermal resistance has to be considered.
Vout Basic Adjustable Regulator
Figure 1: Vout Basic Adjustable Regulator
Protection diodes
Figure 2: Protection diodes
Connections for Best Load Regulation
Figure 3: Connections for Best Load Regulation

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix standard bare die components are designed for thermosonic GOLD wire bonding and AuSi eutectic die attach. For AuSn or AuGe die attach process, Ti/Pt/Au or Ti/Pd/Au are recommended backside metallization.
For soft solder die attach, backside metallization may be any of Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au.
For silver filled conductive epoxy die attach, AuSi as well as Ti/Ni/Au, Ti/Pt/Au, Ti/Pd/Au may be used.
In general, after die attach, prior to wire bonding operation an oxygen RF plasma clean operation is recommended.
IMPORTANT NOTE: Aluminum wire should not be used with gold pads due to potential reliability problem known as purple plague. Same it applies to Aluminum bonding pads with gold wire! In the transition from SnPb solder to lead free and RoHS compliant packaging and assembly processes the reflow temperature has increased in some cases from 180°C to 220°C. This may cause an increase of the rate of formation of gold aluminum intermetallic compounds that are brittle and are conducive to increased contact resistance and or bond failure. See Application note AN-SMX-000.

STANDARD PRODUCTS ORDERING INFORMATION

SMS P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
SMS1085CD-BD -WP 1000 -FF 1000
SMS1085CD-BD -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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