Low Drop Voltage Regulators: SMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS same as AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V TO220-5L AMS Advanced Monolithic Systems AMS1505CTV-3.5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS same as AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V TO220-5L AMS Advanced Monolithic Systems AMS1505CTV-3.5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO220-5L AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V,SMS1505CTV-3.5V,5A Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Low Drop Voltage Regulators: SMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS same as AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V TO220-5L AMS Advanced Monolithic Systems AMS1505CTV-3.5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Low Drop Voltage Regulators: SMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS same as AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V TO220-5L AMS Advanced Monolithic Systems AMS1505CTV-3.5V manufactured by Semiconix Semiconductor - Gold chip technology for known good Low Drop Voltage Regulators die, Low Drop Voltage Regulators flip chip, Low Drop Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. TO220-5L AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V,SMS1505CTV-3.5V,5A Low Drop Voltage Regulators,,Low Drop Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS1505CTV-3.5V - nanoDFN GOLD CHIP TECHNOLOGY™ TO220-5L 5A LOW DROPOUT VOLTAGE REGULATORS FEATURES APPLICATIONS 5A Low Drop Voltage Regulators - nDFN Adjustable or Fixed Output 1.5V, 2.5V, 2.85V, 3.0V, 3.3V, 3.5V and 5.0V Output Current of 1.5A Low Dropout, 500mV at 1.5A Output Current Fast Transient Response Remote Sense High reliability nanoDFN package Unique 10mils thin design Gold over nickel metallization RoHS compliant, Lead Free Compatible with surface mount, chip and wire and flip chip assembly process. Available packaged in TO220-5L High Current Regulators Post Regulators for Switching Supplies Adjustable Power Supply Notebook/Personal Computer Supplies Chip on Board System in package SIP Hybrid Circuits SMS1505CTV-3.5V AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS 5A LOW DROPOUT VOLTAGE REGULATORS - PRODUCT DESCRIPTION SMS1505 series of adjustable and fixed low dropout voltage regulators are designed to provide 5A output current to power the new generation of microprocessors. The dropout voltage of the device is 100mV at light loads and rising to 500mV at maximum output current. A second low current input voltage 1V or greater then the output voltage is required to achieve this dropout. The SMS1505 can also be used as a single supply device. New features have been added to the SMS1505: a remote Sense pin is brought out virtually eliminating output voltage variations due to load changes. The typical load regulation, measured at the Sense pin, for a load current step of 100mA to 5A is less than 1mV. The SMS1505 series has fast transient response. The Adjust pin is brought out on fixed devices. To further improve the transient response the addition of a small capacitor on the Adjust pin is recommended. The SMS1505 series are ideal for generating processor supplies of 2V to 3V on motherboards where both 5V and 3.3V supplies are available. The SMS1505 devices are offered in 5 lead TO-220, 5L TO-263 (plastic DD) and 5L TO-252 (DPAK) packages. Semiconix Low Drop Voltage Regulators Integrated Circuits series are available in very thin 0201 nanoDFN package. These products are ideal for surface mount, hybrid circuits and multi chip module applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit VPOWER Input Voltage 7 V VCONTROL Input Voltage 13 V Storage Temperature -65 to +150 °C Control Section 0° C to 125 °C Power Transistor 0° C to 150 ° C Electrical Characteristics at IOUT=0 mA, and TJ=+25°C unless otherwise specified. Name Symbol Test Conditions Value Unit Min. Typ. Max Output Voltage (Note 2) VCONTROL=6V, VPOWER=4V, ILOAD=0mA 3.479 3.5 3.521 V Output Voltage, over the full operating temperature range. VCONTROL=5V, VPOWER=4.3V, ILOAD=0mA to 5A 3.43 3.5 3.535 V Line Regulation ILOAD=10 mA, 1.5V≤ (VCONTROL - VOUT)≤12V,0.8V≤ (VPOWER - VOUT)≤5.5V 1 3 mV Load Regulation, (Notes 2, 3) VCONTROL=VOUT + 2.5V, VPOWER=VOUT + 0.8V,ILOAD=10mA to 5A 1 5 mV Control Dropout (VCONTROL - VOUT) VPOWER=VOUT + 0.8V, ILOAD=10mA 1 1.15 V Control Dropout (VCONTROL - VOUT) VPOWER=VOUT + 0.8V, ILOAD=5A 1.15 1.3 V Power Dropout (VPOWER - VOUT) VCONTROL=VOUT + 2.5V, ILOAD=10mA 0.1 0.17 V Power Dropout (VPOWER - VOUT) VCONTROL=VOUT + 2.5V, ILOAD=5A 0.45 0.5 V Current Limit (VIN - VOUT)=5V 5 7 8.1 A Minimum Load Current VCONTROL=5V, VPOWER=3.3V, VADJ=0V (Note 3) 5 10 mA Control Pin Current VCONTROL=VOUT + 2.5V, VPOWER=VOUT + 0.8V,ILOAD=10mA to 5A 50 85 mA Ground Pin Current VCONTROL=VOUT + 2.5V, VPOWER=VOUT + 0.8V,ILOAD=10mA to 5A 6 10 mA Ripple Rejection VCONTROL=VPOWER=VOUT + 2.5V, VRIPPLE=1VP-P,ILOAD=2A 60 80 dB Thermal Regulation TA=25°C, 30ms pulse 0.002 0.02 %W Thermal Resistance Junction-to-Case T Package: Control Circuitry/ Power Transistor 0.65/2.70 °C/W Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Note 2: Unless otherwise specified VOUT = VSENSE. For the adjustable device VADJ = 0V. Note 3: The dropout voltage for the AMS1501 is caused by either minimum control voltage or minimum power voltage. The specifications represent the minimum input/output voltage required to maintain 1% regulation. Note 4: For the adjustable device the minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor divider used to set the output voltage is selected to meet the minimum load current requirement. Note 5: The control pin current is the drive current required for the output transistor. This current will track output current with a ratio of about 1:100. The minimum value is equal to the quiescent current of the device. SPICE MODEL AMS1505CTV-3.5V spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V GENERAL DIE INFORMATION Substrate Thickness [mils] Package size Pads dimensions per drawing Backside Silicon Si 10±2 3.81x3.05mm [150x120mils] Gold Tin, Ni/Au, 5µm±1 thickness, solder reflow assembly Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS SMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS SMS1505CTV-3.5V AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS TO220-5L Package pinout Pin # Function 1 Sense 2 GND/Adj 3 Out 4 Vcontrol 5 Vpower TO220-5L SMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS nanoDFN SMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS APPLICATION HINTS PIN FUNCTIONS Sense (Pin 1): This pin is the positive side of the reference voltage for the device. With this pin it is possible to Kelvin sense the output voltage at the load. Adjust (Pin 2/5): This pin is the negative side of the reference voltage for the device. Adding a small bypass capacitor from the Adjust pin to ground improves the transient response. For fixed voltage devices the Adjust pin is also brought out to allow the user to add a bypass capacitor. GND (Pin 2/5): For fixed voltage devices this is the bottom of the resistor divider that sets the output voltage. VPOWER (Pin 5/6): This pin is the collector to the power device of the SMS1505. The output load current is supplied through this pin. The voltage at this pin must be between 0.1V and 0.8V greater than the output voltage for the device to regulate. VCONTROL (Pin 4/3): This pin is the supply pin for the control circuitry of the device. The current flow into this pin will be about 1% of the output current. The voltage at this pin must be 1.3V or greater than the output voltage for the device to regulate. Output (Pin 3/4): This is the power output of the device. APPLICATION HINTS The SMS1505 is designed to make use of multiple power supplies, existing in most systems, to reduce the dropout voltage. One of the advantages of the two supply approach is maximizing the efficiency. The second supply is at least 1V greater than output voltage and is providing the power for the control circuitry and supplies the drive current to the NPN output transistor. This allows the NPN to be driven into saturation; thereby reducing the dropout voltage by a VBE compared to conventional designs. For the control voltage the current requirement is small equal to about 1% of the output current or approximately 15mA for a 1.5A load. Most of this current is drive current for the NPN output transistor. This drive current becomes part of the output current. The maximum voltage on the Control pin is 13V. The maximum voltage at the Power pin is 7V. Ground pin current for fixed voltage devices is typical 6mA and is constant as a function of load. Adjust pin current for adjustable devices is 60?A at 25°C and varies proportional to absolute temperature. The improved frequency compensation of SMS1505 permits the use of capacitors with very low ESR. This is critical in addressing the needs of modern, low voltage high sped microprocessors. Output voltage tolerances are tighter and include transient response as part of the specification. Designed to meet the fast current load step requirements, the SMS1505 also saves total cost by needing less output capacitance to maintain regulation. Careful design of the SMS1505 has eliminated any supply sequencing issues associated with a dual supply system. The output voltage will not turn on until both supplies are operating. If the control voltage comes up first, the output current will be limited to a few milliamperes until the power input voltage comes up. If power input comes up first the output will not turn on at all until the control voltage comes up. The output can never come up unregulated. By tying the control and power inputs together the SMS1505 can also be operated as a single supply device. In single supply operation the dropout will be determined by the minimum control voltage. The new features of the SMS1505 require additional pins over the traditional 3-terminal regulator. Both the fixed and adjustable versions have remote sense pins, permitting very accurate regulation of output voltage at the load, rather than at the regulator. As a result, over an output current range of 100mA to 1.5A with a 2.5V output, the typical load regulation is less than 1mV. For the fixed voltages the adjust pin is brought out allowing the user to improve transient response by bypassing the internal resistor divider. Optimum transient response is provided using a capacitor in the range of 0.1µF to 1µF for bypassing the Adjust pin. The value chosen will depend on the amount of output capacitance in the system. In addition to the enhancements mentioned, the reference accuracy has been improved by a factor of two with a guaranteed initial tolerance of ±0.6% at 25°C. This device can hold 1% accuracy over the full temperature range and load current range guaranteed, when combined with ratiometrically accurate internal divider resistors and operating with an input/output differential of well under 1V. Typical applications for the SMS1505 include 3.3V to 2.5V conversion with a 5V control supply, 5V to 4.2V conversion with a 12V control supply or 5V to3.6V conversion with a 12V control supply. Capable of 1.5A of output current with a maximum dropout of 0.8V the SMS1505 also has a fast transient response that allows it to handle large current changes. The device is fully protected against overcurrent and overtemperature conditions. Grounding and Output Sensing The SMS1505 allows true Kelvin sensing for both the high and low side of the load. As a result the voltage regulation at he load can be easily optimized. Voltage drops due to parasitic resistances between the regulator and the load can be placed inside the regulation loop of the SMS1505. The advantages of remote sensing are illustrated in figures 1 through 3. Figure 1 shows the device connected as a conventional 3 terminal regulator with the Sense lead connected directly to the output of the device. RP is the parasitic resistance of the connections between the device and the load. Typically RP is made up of the PC traces and /or connector resistances (in the case of a modular regulator) between the regulator and the load. Trace A of figure 3 illustrates the effect of RP. Very small resistances cause significant load regulation steps. Figure 2 shows the device connected to take advantage of the remote sense feature. The Sense pin and the top of the resistor divider are connected to the top of the load; the bottom of the resistor divider is connected to the bottom of the load. RP is now connected inside the regulation loop of the SMS1505 and for reasonable values of RP the load regulation at the load will be negligible. The effect on output regulation can be seen in trace B of figure 3. Voltage drops due to RP are not eliminated; they will add to the dropout voltage of the regulator regardless of whether they are inside or outside the regulation loop. The SMS1505 can control the voltage at the load as long as the input-output voltage is greater than the total of the dropout voltage of the device plus the voltage drop across RP. Stability The circuit design used in the SMS1505 series requires the use of an output capacitor as part of the device frequency compensation. The addition of 150µF aluminum electrolytic or a 22µF solid tantalum on the output will ensure stability for all operating conditions. For best frequency response use capacitors with an ESR of less than 1?. In order to meet the transient requirements of the load larger value capacitors are needed. Tight voltage tolerances are required in the power supply. To limit the high frequency noise generated by the load high quality bypass capacitors must be used. In order to limit parasitic inductance (ESL) and resistance (ESR) in the capacitors to acceptable limits, multiple small ceramic capacitors in addition to high quality solid tantalum capacitors are required. When the adjustment terminal is bypassed to improve the ripple rejection, the requirement for an output capacitor increases. The Adjust pin is brought out on the fixed voltage device specifically to allow this capability. To ensure good transient response with heavy load current changes capacitor values on the order of 100µF are used in the output of many regulators. To further improve stability and transient response of these devices larger values of output capacitor can be used. The modern systems generate large high frequency current transients. The load current step contains higher order frequency components than the output coupling network must handle until the regulator throttles to the load current level. Because they contain parasitic resistance and inductance, capacitors are not ideal elements. These parasitic elements dominate the change in output voltage at the beginning of a transient load step change. The ESR of the output capacitors produces an instantaneous step in output voltage (ΔV=ΔI)(ESR). The ESL of the output capacitors produces a droop proportional to the rate of change of the output current (V=L)(ΔI/Δt). The output capacitance produces a change in output voltage proportional to the time until the regulator can respond (ΔV=Δt) (ΔI/C). Figure 4 illustrates these transient effects. Output Voltage The SMS1505 series develops a 1.25V reference voltage between the Sense pin and the Adjust pin (Figure5). Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. In general R1 is chosen so that this current is the specified minimum load current of 10mA.The current out of the Adjust pin is small, typically 50?A and it adds to the current from R1. Because IADJ is very small it needs to be considered only when very precise output voltage setting is required. For best regulation the top of the resistor divider should be connected directly to the Sense pin. Protection Diodes Unlike older regulators, the SMS1505 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent die over-stress. Internal resistors are limiting the internal current paths on the SMS1505 adjustment pin, therefore even with bypass capacitors on the adjust pin no protection diode is needed to ensure device safety under short-circuit conditions. The Adjust pin can be driven on a transient basis ±7V with respect to the output without any device degradation. Diodes between the Output pin and VPOWER pin are not usually needed. Microsecond surge currents of 25A to 50A can be handled by the internal diode between the Output pin and VPOWER pin of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000µF to 5000µF and the VPOWER pin is instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the SMS1505 is used (Figure 6). Normal power supply cycling or even plugging and unplugging in the system will not generate current large enough to do any damage. If the SMS1505 is connected as a single supply device with the control and power input pins shorted together the internal diode between the output and the power input pin will protect the control input pin. As with any IC regulator, none the protection circuitry will be functional and the internal transistors will break down if the maximum input to output voltage differential is exceeded. Thermal Considerations The SMS1505 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load conditions. Careful consideration must be given to all sources of thermal resistance from junction to ambient, including junction-to-case, case-to-heat sink interface and heat sink resistance itself. Thermal resistance specification for both the Control Section and the Power Transistor are given in the electrical characteristics. The thermal resistance of the Control section is given as 0.65°C/W and junction temperature of the Control section can run up to 125°C. The thermal resistance of the Power section is given as 2.7°C/W and junction temperature of the Power section can run up to 150°C. Due to the thermal gradients between the power transistor and the control circuitry there is a significant difference in thermal resistance between the Control and Power sections. Virtually all the power dissipated by the device is dissipated in the power transistor. The temperature rise in the power transistor will be greater than the temperature rise in the Control section making the thermal resistance lower in the Control section. At power levels below 12W the temperature gradient will be less than 25°C and the maximum ambient temperature will be determined by the junction temperature of the Control section. This is due to the lower maximum junction temperature in the Control section. At power levels above 12W the temperature gradient will be greater than 25°C and the maximum ambient temperature will be determined by the Power section. In both cases the junction temperature is determined by the total power dissipated in the device. For most low dropout applications the power dissipation will be less than 12W. The power in the device is made up of two components: the power in the output transistor and the power in the drive circuit. The power in the control circuit is negligible. The power in the drive circuit is equal to: PDRIVE = (VCONTROL - VOUT)(ICONTROL) where ICONTROL is equal to between IOUT/100(typ) and IOUT/58(max). The power in the output transistor is equal to: POUTPUT = (VPOWER -VOUT)(IOUT) The total power is equal to: PTOTAL = PDRIVE + POUTPUT Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for the heat flow. In order to ensure the best possible thermal flow from this area of the package to the heat sink proper mounting is required. Thermal compound at the case-to-heat sink interface is recommended. A thermally conductive spacer can be used, if the case of the device must be electrically isolated, but its added contribution to thermal resistance has to be considered. Conventional Load Sensing Figure 1: Conventional Load Sensing Remote Load Sensing Figure 2: Remote Load Sensing Remote Sensing Improves Load Regulation Figure 3: Remote Sensing Improves Load Regulation Stability and ESR effects Figure 4: Stability and ESR effects Setting Output Voltage Figure 5: Setting Output Voltage Optional Clamp Diodes Protect Against Input Crowbar Circuits Figure 6: Optional Clamp Diodes Protect Against Input Crowbar Circuits SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE SMX-nDFN - NanoDFN package is a very thin (10mils) proprietary wafer level chip size package W-CSP technology developed by Semiconix. SMX-nDFN is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at >220°C, clean, etc. SMX-nDFN packages can also be attached with conductive silver epoxy in low temperature applications. The assembly process is also very simple and inexpensive consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. SMX-nDFN packages are available in many sizes with landing pads compatible with the industry standard CSP as well as many surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) TAPE / REEL MIN QUANTITY U/P($) nDFN-4 SMS1505CTV-3.5V-nDFN-4 -WP 1000 -TR 1000 nDFN-4 SMS1505CTV-3.5V-nDFN-4 -WP 5000 -TR 5000 TO220-5L SMS1505CTV-3.5V-TO220-5L -WP 1000 -TR 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. 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semiconix semiconductor - where the future is today - gold chip technology SMS1505CTV-3.5V - nanoDFN
GOLD CHIP TECHNOLOGY™ TO220-5L 5A LOW DROPOUT VOLTAGE REGULATORS

FEATURES APPLICATIONS 5A Low Drop Voltage Regulators - nDFN
Adjustable or Fixed Output
1.5V, 2.5V, 2.85V, 3.0V, 3.3V, 3.5V and 5.0V
Output Current of 1.5A
Low Dropout, 500mV at 1.5A Output Current
Fast Transient Response
Remote Sense
High reliability nanoDFN package
Unique 10mils thin design
Gold over nickel metallization
RoHS compliant, Lead Free
Compatible with surface mount, chip and wire and flip chip assembly process.
Available packaged in TO220-5L
High Current Regulators
Post Regulators for Switching Supplies
Adjustable Power Supply
Notebook/Personal Computer Supplies
Chip on Board
System in package SIP
Hybrid Circuits
SMS1505CTV-3.5V AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS

5A LOW DROPOUT VOLTAGE REGULATORS - PRODUCT DESCRIPTION
SMS1505 series of adjustable and fixed low dropout voltage regulators are designed to provide 5A output current to power the new generation of microprocessors. The dropout voltage of the device is 100mV at light loads and rising to 500mV at maximum output current. A second low current input voltage 1V or greater then the output voltage is required to achieve this dropout. The SMS1505 can also be used as a single supply device. New features have been added to the SMS1505: a remote Sense pin is brought out virtually eliminating output voltage variations due to load changes. The typical load regulation, measured at the Sense pin, for a load current step of 100mA to 5A is less than 1mV. The SMS1505 series has fast transient response. The Adjust pin is brought out on fixed devices. To further improve the transient response the addition of a small capacitor on the Adjust pin is recommended. The SMS1505 series are ideal for generating processor supplies of 2V to 3V on motherboards where both 5V and 3.3V supplies are available. The SMS1505 devices are offered in 5 lead TO-220, 5L TO-263 (plastic DD) and 5L TO-252 (DPAK) packages.
Semiconix Low Drop Voltage Regulators Integrated Circuits series are available in very thin 0201 nanoDFN package.
These products are ideal for surface mount, hybrid circuits and multi chip module applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
VPOWER Input Voltage 7 V
VCONTROL Input Voltage 13 V
Storage Temperature -65 to +150 °C
Control Section 0° C to 125 °C
Power Transistor 0° C to 150 ° C

Electrical Characteristics at IOUT=0 mA, and TJ=+25°C unless otherwise specified.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Output Voltage (Note 2) VCONTROL=6V, VPOWER=4V, ILOAD=0mA 3.479 3.5 3.521 V
Output Voltage, over the full operating temperature range. VCONTROL=5V, VPOWER=4.3V, ILOAD=0mA to 5A 3.43 3.5 3.535 V
Line Regulation ILOAD=10 mA, 1.5V≤ (VCONTROL - VOUT)≤12V,0.8V≤ (VPOWER - VOUT)≤5.5V 1 3 mV
Load Regulation, (Notes 2, 3) VCONTROL=VOUT + 2.5V, VPOWER=VOUT + 0.8V,ILOAD=10mA to 5A 1 5 mV
Control Dropout (VCONTROL - VOUT) VPOWER=VOUT + 0.8V, ILOAD=10mA 1 1.15 V
Control Dropout (VCONTROL - VOUT) VPOWER=VOUT + 0.8V, ILOAD=5A 1.15 1.3 V
Power Dropout (VPOWER - VOUT) VCONTROL=VOUT + 2.5V, ILOAD=10mA 0.1 0.17 V
Power Dropout (VPOWER - VOUT) VCONTROL=VOUT + 2.5V, ILOAD=5A 0.45 0.5 V
Current Limit (VIN - VOUT)=5V 5 7 8.1 A
Minimum Load Current VCONTROL=5V, VPOWER=3.3V, VADJ=0V (Note 3) 5 10 mA
Control Pin Current VCONTROL=VOUT + 2.5V, VPOWER=VOUT + 0.8V,ILOAD=10mA to 5A 50 85 mA
Ground Pin Current VCONTROL=VOUT + 2.5V, VPOWER=VOUT + 0.8V,ILOAD=10mA to 5A 6 10 mA
Ripple Rejection VCONTROL=VPOWER=VOUT + 2.5V, VRIPPLE=1VP-P,ILOAD=2A 60 80 dB
Thermal Regulation TA=25°C, 30ms pulse 0.002 0.02 %W
Thermal Resistance Junction-to-Case T Package: Control Circuitry/ Power Transistor 0.65/2.70 °C/W
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For guaranteed specifications and test conditions, see the
Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed.
Note 2: Unless otherwise specified VOUT = VSENSE. For the adjustable device VADJ = 0V.
Note 3: The dropout voltage for the AMS1501 is caused by either minimum control voltage or minimum power voltage. The specifications represent the
minimum input/output voltage required to maintain 1% regulation.
Note 4: For the adjustable device the minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor
divider used to set the output voltage is selected to meet the minimum load current requirement.
Note 5: The control pin current is the drive current required for the output transistor. This current will track output current with a ratio of about 1:100. The
minimum value is equal to the quiescent current of the device.
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Package size Pads dimensions per drawing Backside
Silicon
Si
10±2 3.81x3.05mm
[150x120mils]
Gold Tin, Ni/Au, 5µm±1 thickness, solder reflow assembly Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
SMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS SMS1505CTV-3.5V AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS
TO220-5L Package pinout
Pin # Function
1 Sense
2 GND/Adj
3 Out
4 Vcontrol
5 Vpower
TO220-5L SMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS
nanoDFN SMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V, AMS Advanced Monolithic Systems AMS1505CTV-3.5V AMS Advanced Monolithic Systems AMS1505CTV-3.5V 5A LOW DROPOUT VOLTAGE REGULATORS

APPLICATION HINTS

PIN FUNCTIONS 

Sense (Pin 1): This pin is the positive side of the reference voltage for the device. With this pin it is possible to Kelvin sense the output voltage at the load.

Adjust (Pin 2/5): This pin is the negative side of the reference voltage for the device. Adding a small bypass capacitor from the Adjust pin to ground improves the transient response. For fixed voltage devices the Adjust pin is also brought out to allow the user to add a bypass capacitor.

GND (Pin 2/5): For fixed voltage devices this is the bottom of the resistor divider that sets the output voltage.

VPOWER (Pin 5/6): This pin is the collector to the power device of the SMS1505. The output load current is supplied through this pin. The voltage at this pin must be between 0.1V and 0.8V greater than the output voltage for the device to regulate.

VCONTROL (Pin 4/3): This pin is the supply pin for the control circuitry of the device. The current flow into this pin will be about 1% of the output current. The voltage at this pin must be 1.3V or greater than the output voltage for the device to regulate.

Output (Pin 3/4): This is the power output of the device.

APPLICATION HINTS

The SMS1505 is designed to make use of multiple power supplies, existing in most systems, to reduce the dropout voltage. One of the advantages of the two supply approach is maximizing the efficiency.
The second supply is at least 1V greater than output voltage and is providing the power for the control circuitry and supplies the drive current to the NPN output transistor. This allows the NPN to be driven into saturation; thereby reducing the dropout voltage by a VBE compared to conventional designs. For the control voltage the current requirement is small equal to about 1% of the output current or approximately 15mA for a 1.5A load. Most of this current is drive current for the NPN output transistor. This drive current becomes part of the output current. The maximum voltage on the Control pin is 13V. The maximum voltage at the Power pin is 7V. Ground pin current for fixed voltage devices is typical 6mA and is constant as a function of load. Adjust pin current for adjustable devices is 60?A at 25°C and varies proportional to absolute temperature.
The improved frequency compensation of SMS1505 permits the use of capacitors with very low ESR. This is critical in addressing the needs of modern, low voltage high sped microprocessors.
Output voltage tolerances are tighter and include transient response as part of the specification. Designed to meet the fast current load step requirements, the SMS1505 also saves total cost by needing less output capacitance to maintain regulation.
Careful design of the SMS1505 has eliminated any supply sequencing issues associated with a dual supply system. The output voltage will not turn on until both supplies are operating. If the control voltage comes up first, the output current will be limited to a few milliamperes until the power input voltage comes up. If power input comes up first the output will not turn on at all until the control voltage comes up. The output can never come up unregulated. By tying the control and power inputs together the SMS1505 can also be operated as a single supply device. In single supply operation the dropout will be determined by the minimum control voltage.
The new features of the SMS1505 require additional pins over the traditional 3-terminal regulator. Both the fixed and adjustable versions have remote sense pins, permitting very accurate regulation of output voltage at the load, rather than at the regulator. As a result, over an output current range of 100mA to 1.5A with a 2.5V output, the typical load regulation is less than 1mV. For the fixed voltages the adjust pin is brought out allowing the user to improve transient response by bypassing the internal resistor divider. Optimum transient response is provided using a capacitor in the range of 0.1µF to 1µF for bypassing the Adjust pin. The value chosen will depend on the amount of output capacitance in the system.
In addition to the enhancements mentioned, the reference accuracy has been improved by a factor of two with a guaranteed initial tolerance of ±0.6% at 25°C. This device can hold 1% accuracy over the full temperature range and load current range guaranteed, when combined with ratiometrically accurate internal divider resistors and operating with an input/output differential of well under 1V.
Typical applications for the SMS1505 include 3.3V to 2.5V conversion with a 5V control supply, 5V to 4.2V conversion with a 12V control supply or 5V to3.6V conversion with a 12V control supply. Capable of 1.5A of output current with a maximum dropout of 0.8V the SMS1505 also has a fast transient response that allows it to handle large current changes. The device is fully protected against overcurrent and overtemperature conditions.

Grounding and Output Sensing
The SMS1505 allows true Kelvin sensing for both the high and low side of the load. As a result the voltage regulation at he load can be easily optimized. Voltage drops due to parasitic resistances between the regulator and the load can be placed inside the regulation loop of the SMS1505. The advantages of remote sensing are illustrated in figures 1 through 3.
Figure 1 shows the device connected as a conventional 3 terminal regulator with the Sense lead connected directly to the output of the device. RP is the parasitic resistance of the connections between the device and the load. Typically RP is made up of the PC traces and /or connector resistances (in the case of a modular regulator) between the regulator and the load. Trace A of figure 3 illustrates the effect of RP. Very small resistances cause significant load regulation steps.
Figure 2 shows the device connected to take advantage of the remote sense feature. The Sense pin and the top of the resistor divider are connected to the top of the load; the bottom of the resistor divider is connected to the bottom of the load. RP is now connected inside the regulation loop of the SMS1505 and for reasonable values of RP the load regulation at the load will be negligible. The effect on output regulation can be seen in trace B of figure 3.
Voltage drops due to RP are not eliminated; they will add to the dropout voltage of the regulator regardless of whether they are inside or outside the regulation loop. The SMS1505 can control the voltage at the load as long as the input-output voltage is greater than the total of the dropout voltage of the device plus the voltage drop across RP.

Stability
The circuit design used in the SMS1505 series requires the use of an output capacitor as part of the device frequency compensation.
The addition of 150µF aluminum electrolytic or a 22µF solid tantalum on the output will ensure stability for all operating conditions. For best frequency response use capacitors with an ESR of less than 1?.
In order to meet the transient requirements of the load larger value capacitors are needed. Tight voltage tolerances are required in the power supply. To limit the high frequency noise generated by the load high quality bypass capacitors must be used. In order to limit parasitic inductance (ESL) and resistance (ESR) in the capacitors to acceptable limits, multiple small ceramic capacitors in addition to high quality solid tantalum capacitors are required.
When the adjustment terminal is bypassed to improve the ripple rejection, the requirement for an output capacitor increases. The Adjust pin is brought out on the fixed voltage device specifically to allow this capability. To ensure good transient response with heavy load current changes capacitor values on the order of 100µF are used in the output of many regulators. To further improve stability and transient response of these devices larger values of output capacitor can be used.
The modern systems generate large high frequency current transients. The load current step contains higher order frequency components than the output coupling network must handle until the regulator throttles to the load current level. Because they contain parasitic resistance and inductance, capacitors are not ideal elements. These parasitic elements dominate the change in output voltage at the beginning of a transient load step change.
The ESR of the output capacitors produces an instantaneous step in output voltage (ΔV=ΔI)(ESR). The ESL of the output capacitors produces a droop proportional to the rate of change of the output current (V=L)(ΔI/Δt). The output capacitance produces a change in output voltage proportional to the time until the regulator can respond (ΔV=Δt) (ΔI/C). Figure 4 illustrates these transient effects.

Output Voltage
The SMS1505 series develops a 1.25V reference voltage between the Sense pin and the Adjust pin (Figure5). Placing a resistor between these two terminals causes a constant current to flow through R1 and down through R2 to set the overall output voltage. In general R1 is chosen so that this current is the specified minimum load current of 10mA.The current out of the Adjust pin is small, typically 50?A and it adds to the current from R1. Because IADJ is very small it needs to be considered only when very precise output voltage setting is required. For best regulation the top of the resistor divider should be connected directly to the Sense pin.

Protection Diodes
Unlike older regulators, the SMS1505 family does not need any protection diodes between the adjustment pin and the output and from the output to the input to prevent die over-stress. Internal resistors are limiting the internal current paths on the SMS1505 adjustment pin, therefore even with bypass capacitors on the adjust pin no protection diode is needed to ensure device safety under short-circuit conditions. The Adjust pin can be driven on a transient basis ±7V with respect to the output without any device degradation.
Diodes between the Output pin and VPOWER pin are not usually needed. Microsecond surge currents of 25A to 50A can be handled by the internal diode between the Output pin and VPOWER pin of the device. In normal operations it is difficult to get those values of surge currents even with the use of large output capacitances. If high value output capacitors are used, such as 1000µF to 5000µF and the VPOWER pin is instantaneously shorted to ground, damage can occur. A diode from output to input is recommended, when a crowbar circuit at the input of the SMS1505 is used (Figure 6). Normal power supply cycling or even plugging and unplugging in the system will not generate current large enough to do any damage.
If the SMS1505 is connected as a single supply device with the control and power input pins shorted together the internal diode between the output and the power input pin will protect the control input pin. As with any IC regulator, none the protection circuitry will be functional and the internal transistors will break down if the maximum input to output voltage differential is exceeded.

Thermal Considerations
The SMS1505 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load conditions.
Careful consideration must be given to all sources of thermal resistance from junction to ambient, including junction-to-case, case-to-heat sink interface and heat sink resistance itself.

Thermal resistance specification for both the Control Section and the Power Transistor are given in the electrical characteristics. The thermal resistance of the Control section is given as 0.65°C/W and junction temperature of the Control section can run up to 125°C. The thermal resistance of the Power section is given as 2.7°C/W and junction temperature of the Power section can run up to 150°C. Due to the thermal gradients between the power transistor and the control circuitry there is a significant difference in thermal resistance between the Control and Power sections. Virtually all the power dissipated by the device is dissipated in the power transistor. The temperature rise in the power transistor will be greater than the temperature rise in the Control section making the thermal resistance lower in the Control section. At power levels below 12W the temperature gradient will be less than 25°C and the maximum ambient temperature will be determined by the junction temperature of the Control section. This is due to the lower maximum junction temperature in the Control section. At power levels above 12W the temperature gradient will be greater than 25°C and the maximum ambient temperature will be determined by the Power section. In both cases the junction temperature is determined by the total power dissipated in the device. For most low dropout applications the power dissipation will be less than 12W.
The power in the device is made up of two components: the power in the output transistor and the power in the drive circuit. The power in the control circuit is negligible. The power in the drive circuit is equal to:
PDRIVE = (VCONTROL - VOUT)(ICONTROL)
where ICONTROL is equal to between IOUT/100(typ) and IOUT/58(max).
The power in the output transistor is equal to:
POUTPUT = (VPOWER -VOUT)(IOUT)
The total power is equal to:
PTOTAL = PDRIVE + POUTPUT
Junction-to-case thermal resistance is specified from the IC junction to the bottom of the case directly below the die. This is the lowest resistance path for the heat flow. In order to ensure the best possible thermal flow from this area of the package to the heat sink proper mounting is required. Thermal compound at the case-to-heat sink interface is recommended. A thermally conductive spacer can be used, if the case of the device must be electrically isolated, but its added contribution to thermal resistance has to be considered.
Conventional Load Sensing
Figure 1: Conventional Load Sensing
Remote Load Sensing
Figure 2: Remote Load Sensing
Remote Sensing Improves Load Regulation
Figure 3: Remote Sensing Improves Load Regulation
Stability and ESR effects
Figure 4: Stability and ESR effects
Setting Output Voltage
Figure 5: Setting Output Voltage
Optional Clamp Diodes Protect Against Input Crowbar Circuits
Figure 6: Optional Clamp Diodes Protect Against Input Crowbar Circuits

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
SMX-nDFN - NanoDFN package is a very thin (10mils) proprietary wafer level chip size package W-CSP technology developed by Semiconix.
SMX-nDFN is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at >220°C, clean, etc.
SMX-nDFN packages can also be attached with conductive silver epoxy in low temperature applications. The assembly process is also very simple and inexpensive consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. SMX-nDFN packages are available in many sizes with landing pads compatible with the industry standard CSP as well as many surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) TAPE / REEL MIN QUANTITY U/P($)
nDFN-4 SMS1505CTV-3.5V-nDFN-4 -WP 1000 -TR 1000
nDFN-4 SMS1505CTV-3.5V-nDFN-4 -WP 5000 -TR 5000
TO220-5L SMS1505CTV-3.5V-TO220-5L -WP 1000 -TR 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

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