Shunt Voltage Regulators: SMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR same as AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL SOT89 AMS Advanced Monolithic Systems AMS431BL manufactured by Semiconix Semiconductor - Gold chip technology for known good Shunt Voltage Regulators die, Shunt Voltage Regulators flip chip, Shunt Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Shunt Voltage Regulators: SMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR same as AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL SOT89 AMS Advanced Monolithic Systems AMS431BL manufactured by Semiconix Semiconductor - Gold chip technology for known good Shunt Voltage Regulators die, Shunt Voltage Regulators flip chip, Shunt Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT89 AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL,SMS431BL,2.5V Shunt Voltage Regulators,,Shunt Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire Shunt Voltage Regulators: SMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR same as AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL SOT89 AMS Advanced Monolithic Systems AMS431BL manufactured by Semiconix Semiconductor - Gold chip technology for known good Shunt Voltage Regulators die, Shunt Voltage Regulators flip chip, Shunt Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor Shunt Voltage Regulators: SMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR same as AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL SOT89 AMS Advanced Monolithic Systems AMS431BL manufactured by Semiconix Semiconductor - Gold chip technology for known good Shunt Voltage Regulators die, Shunt Voltage Regulators flip chip, Shunt Voltage Regulators die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components manufactured by Semiconix Semiconductor. Gold metallization for interconnections instead of aluminum or copper, for high reliability devices for system in package applications using silicon printed circuit boards, ceramic substrates or chip on board, assembled via flip chip or chip and wire. SOT89 AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL,SMS431BL,2.5V Shunt Voltage Regulators,,Shunt Voltage Regulators, gold,chip,goldchip,gold chip technology, known good die, flip chip, bare die, wafer foundry, discrete semiconductors, integrated circuits, integrated passive components,gold metallization, aluminum, copper, system in package, SIP, silicon printed circuit board, silicon PCB, ceramic substrates, chip on board, flip chip, chip and gold wire REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP semiconix semiconductor - where the future is today - gold chip technology SMS431BL - FLIP CHIP GOLD CHIP TECHNOLOGY™ PRECISION ADJUSTABLE SHUNT REGULATOR FEATURES APPLICATIONS PRECISION ADJUSTABLE SHUNT REGULATOR - FLIP CHIP Trimmed 0.25% Reference Wide Operating Current Range 250μA to 150mA Low Dynamic Output Impedance Low Output Noise Nominal Temperature Range to 85°C Temperature-Compensated: 60ppm/°C Internal Amplifier with 150mA Capability High reliability Unique new design in 0603 style case Gold metallization RoHS compliant, Lead Free Compatible with both chip and wire, flip chip and surface mount assembly. Battery Powered Systems Switching Power Supplies Adjustable Power Supplies Linear Regulators Error Amplifiers Notebook/Personal Computer Monitors,VCR,TV Chip on Board System in package SIP Hybrid Circuits SMS431BL AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR PRECISION ADJUSTABLE SHUNT REGULATOR - PRODUCT DESCRIPTION SMS431 is a three-terminal adjustable shunt regulator with guaranteed temperature stability over the entire range of operation. The output voltage can be set to any value between 2.5V (VREF) and 36V by adding two external resistors. Due to the sharp turn-on characteristics this device is an excellent replacement for zener diodes in many applications. SMS431 is available in TO-92, SOIC8, SOT-89 and SOT-23 packages. Flip Chip Shunt Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications. HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001 DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions. ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated) Parameter Symbol Value Unit Cathode Voltage (VZ) 37 V Continuous Cathode Current (IZ) -10 to +150 mA Reference Input Current (IREF) 10 mA Power Dissipation 0.78 0.71 Storage Temperature -65 to +150 °C Operating Junction Temperature -40 to 125 ° C Operating Temperature Range -40 to 85 ° C Electrical Characteristics* at IZ=10 mA and TA=+25°C unless otherwise specified. Name Symbol Test Conditions Value Unit Min. Typ. Max Reference Voltage 2.483 2.495 2.507 V Deviation of Reference Input Voltage over Temperature VZ=VREF (circuit 1),TA=+25°C to +85°C 8 15 mV Deviation of Reference Input Voltage over Temperature VZ=VREF (circuit 1),TA=-40°C to +25°C 8 15 mV Ratio of Change in Reference Voltage to Cathode Voltage VZ from VREF to 10V -0.5 -2.7 mV/V Ratio of Change in Reference Voltage to Cathode Voltage VZ from VREF to 36V -1 -2 mV/V Reference Input Current R1=10kΩ, R2=∞Ω, (test circuit 2) 0.5 4 m A Reference Input Current Deviation over Temperature R1=10kΩ, R2=∞Ω,TA=Full Range, (test circuit 2) 0.4 1.2 m A Off State Cathode Current VZ=36V, VREF=0V ( test circuit 3) 0.04 0.5 m A Minimum Operating Current VZ=VREF (test circuit 1) 100 250 m A Output Impedance f < 1KHz, VZ=VREF,IZ=100µA to 100mA (test circuit 1) 0.25 0.5 W SPICE MODEL AMS431BL spice model pending. CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL GENERAL DIE INFORMATION Substrate Thickness [mils] Size LxW[mils] Bonding pads dimensions per drawing Backside Silicon Si 10±2 41x33±1 [1.03x0.85±0.025] Type Pad metal Thickness Assembly -FC TiW/Au 4µm±1 Wire bonding or Silver epoxy -GB TiW/Au 25µm±2.5 Thermosonic -GT Ti/Pt/AuSn 5µm±1 Reflow -AN Ni/Au 5µm±1 Solder reflow Optional backside coating and/or marking. LAYOUT / DIMENSIONS / PAD LOCATIONS Click to select process: -FC -GB -GT -AN SMS431BL AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR SMS431BL AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR wire bonding SMS431BL AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR thermosonic SMS431BL AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR thermal SMS431BL AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR solder reflow SMS431BL AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR APPLICATION HINTS TYPICAL APPLICATIONS Test Circuit for VZ=VREF Figure 1: Test Circuit for VZ=VREF Test Circuit for VREF vs IZ. Figure 2: Test Circuit for VREF vs IZ. Shunt Regulator Figure 3: Shunt Regulator Single Supply Comparator with Temperature Compensated Threshold Figure 4: Single Supply Comparator with Temperature Compensated Threshold Series Regulator Figure 5: Series Regulator Higher Current Shunt Regulator Figure 6: Higher Current Shunt Regulator Current Limiter or Current Source Figure 7: Current Limiter or Current Source Constant Current Sink Figure 8: Constant Current Sink Over/Under Voltage Protection Circuit Figure 9: Over/Under Voltage Protection Circuit Delay timer Figure 10: Delay timer SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process. Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications. Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc. Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages. STANDARD PRODUCTS ORDERING INFORMATION VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($) Flip chip SMS431BL-FC -WP 1000 -FF 1000 Flip chip SMS431BL-FC -WP 5000 -FF 5000 Gold Bump SMS431BL-GB -WP 1000 -FF 1000 Gold Bump SMS431BL-GB -WP 5000 -FF 5000 Gold-Tin SMS431BL-GT -WP 1000 -FF 1000 Gold-Tin SMS431BL-GT -WP 5000 -FF 5000 Gold/Nickel SMS431BL-AN -WP 1000 -FF 1000 Gold/Nickel SMS431BL-AN -WP 5000 -FF 5000 PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice. LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times. CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met. CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page. SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts. SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. INSTANT QUOTE Semiconix P/N Quantity E-mail DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent. HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH SEMICONIX SEMICONDUCTOR www.semiconix-semiconductor.com Tel:(408)986-8026 Fax:(408)986-8027 SEMICONIX SEMICONDUCTOR Last updated:January 01, 1970 Display settings for best viewing: Current display settings: Page hits: 1 Screen resolution: 1124x864 Screen resolution: Total site visits: 1 Color quality: 16 bit Color quality: bit © 1990-2009 SEMICONIX SEMICONDUCTOR All rights reserved. No material from this site may be used or reproduced without permission.

REGISTER-LOGIN PRODUCTS CROSS REFERENCE INVENTORY REQUEST QUOTE ORDER ONLINE SITE MAP

   
semiconix semiconductor - where the future is today - gold chip technology SMS431BL - FLIP CHIP
GOLD CHIP TECHNOLOGY™ PRECISION ADJUSTABLE SHUNT REGULATOR

FEATURES APPLICATIONS PRECISION ADJUSTABLE SHUNT REGULATOR - FLIP CHIP
Trimmed 0.25% Reference
Wide Operating Current Range 250μA to 150mA
Low Dynamic Output Impedance
Low Output Noise
Nominal Temperature Range to 85°C
Temperature-Compensated: 60ppm/°C
Internal Amplifier with 150mA Capability
High reliability
Unique new design in 0603 style case
Gold metallization
RoHS compliant, Lead Free
Compatible with both chip and wire, flip chip and surface mount assembly.
Battery Powered Systems
Switching Power Supplies
Adjustable Power Supplies
Linear Regulators
Error Amplifiers
Notebook/Personal Computer
Monitors,VCR,TV
Chip on Board
System in package SIP
Hybrid Circuits
SMS431BL AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR

PRECISION ADJUSTABLE SHUNT REGULATOR - PRODUCT DESCRIPTION
SMS431 is a three-terminal adjustable shunt regulator with guaranteed temperature stability over the entire range of operation. The output voltage can be set to any value between 2.5V (VREF) and 36V by adding two external resistors. Due to the sharp turn-on characteristics this device is an excellent replacement for zener diodes in many applications. SMS431 is available in TO-92, SOIC8, SOT-89 and SOT-23 packages.
Flip Chip Shunt Voltage Regulators Integrated Circuits series are available in die form in four different pad compositions: -FC, -GB, -GT and -AN. These products are ideal for high reliability hybrid circuits, multi chip module applications and surface mount applications.

HIGH RELIABILITY BARE DIE AND SYSTEM IN PACKAGE - SHORT APPLICATION NOTE
COB (Chip on Board) and SiP (System-in-Package) are integrating proven mature products in bare die of mixed technologies i.e. Si, GaAs, GaN, InP, passive components, etc that cannot be easily implemented in SOC (System-on-Chip) technology. COB and SiP have small size footprint, high density, shorter design cycle time, easier to redesign and rework, use simpler and less expensive assembly process. For extreme applications the bare die has to withstand also harsh environmental conditions without the protection of a package. KGD, Known Good Die concept is no longer satisfactory if the die cannot withstand harsh environmental conditions and degrades. Standard semiconductor devices supplied by many manufacturers in bare die are build with exposed aluminum pads that are extremely sensitive to moisture and corrosive components of the atmosphere. Semiconix has reengineered industry standard products and now offers known good die for bare die applications with gold interconnection and well-engineered materials that further enhance the die reliability. Semiconix also offers Silicon Printed Circuit Board technology with integrated passive components as a complete high reliability SIP solution for medical, military and space applications. See AN-SMX-001

DISCRETE SEMICONDUCTORS MANUFACTURING PROCESS
Discrete semiconductors are manufactured using Semiconix in house high reliability semiconductor manufacturing processes. All semiconductor devices employ precision doping via ion implantation, silicon nitride junction passivation, platinum silicided contacts and gold interconnect metallization for best performance and reliability. MNOS capacitors, Tantalum Nitride TaN or Sichrome SiCr thin film resistors are easily integrated with discrete semiconductors on same chip to obtain standard and custom complex discrete device solutions.

ABSOLUTE MAXIMUM RATINGS @ 25 °C (unless otherwise stated)
Parameter Symbol Value Unit
Cathode Voltage (VZ) 37 V
Continuous Cathode Current (IZ) -10 to +150 mA
Reference Input Current (IREF) 10 mA
Power Dissipation 0.78 0.71
Storage Temperature -65 to +150 °C
Operating Junction Temperature -40 to 125 ° C
Operating Temperature Range -40 to 85 ° C

Electrical Characteristics* at IZ=10 mA and TA=+25°C unless otherwise specified.
Name Symbol Test Conditions Value Unit
Min. Typ. Max
Reference Voltage 2.483 2.495 2.507 V
Deviation of Reference Input Voltage over Temperature VZ=VREF (circuit 1),TA=+25°C to +85°C 8 15 mV
Deviation of Reference Input Voltage over Temperature VZ=VREF (circuit 1),TA=-40°C to +25°C 8 15 mV
Ratio of Change in Reference Voltage to Cathode Voltage VZ from VREF to 10V -0.5 -2.7 mV/V
Ratio of Change in Reference Voltage to Cathode Voltage VZ from VREF to 36V -1 -2 mV/V
Reference Input Current R1=10kΩ, R2=∞Ω, (test circuit 2) 0.5 4 m A
Reference Input Current Deviation over Temperature R1=10kΩ, R2=∞Ω,TA=Full Range, (test circuit 2) 0.4 1.2 m A
Off State Cathode Current VZ=36V, VREF=0V ( test circuit 3) 0.04 0.5 m A
Minimum Operating Current VZ=VREF (test circuit 1) 100 250 m A
Output Impedance f < 1KHz, VZ=VREF,IZ=100µA to 100mA (test circuit 1) 0.25 0.5 W
SPICE MODEL
Spice model pending.
CROSS REFERENCE PARTS: AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL

GENERAL DIE INFORMATION
Substrate Thickness
[mils]
Size
LxW[mils]
Bonding pads dimensions per drawing Backside
Silicon
Si
10±2 41x33±1
[1.03x0.85±0.025]
TypePad metalThicknessAssembly
-FCTiW/Au4µm±1Wire bonding or Silver epoxy
-GBTiW/Au25µm±2.5Thermosonic
-GTTi/Pt/AuSn5µm±1Reflow
-ANNi/Au5µm±1Solder reflow
Optional backside coating and/or marking.

LAYOUT / DIMENSIONS / PAD LOCATIONS
Click to select process: -FC -GB -GT -AN
SMS431BL AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR SMS431BL AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR
wire bonding SMS431BL AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL, AMS Advanced Monolithic Systems AMS431BL AMS Advanced Monolithic Systems AMS431BL PRECISION ADJUSTABLE SHUNT REGULATOR

APPLICATION HINTS

TYPICAL APPLICATIONS 

Test Circuit for VZ=VREF
Figure 1: Test Circuit for VZ=VREF
Test Circuit for VREF vs IZ.
Figure 2: Test Circuit for VREF vs IZ.
Shunt Regulator
Figure 3: Shunt Regulator
Single Supply Comparator with Temperature Compensated Threshold
Figure 4: Single Supply Comparator with Temperature Compensated Threshold
Series Regulator
Figure 5: Series Regulator
Higher Current Shunt Regulator
Figure 6: Higher Current Shunt Regulator
Current Limiter or Current Source
Figure 7: Current Limiter or Current Source
Constant Current Sink
Figure 8: Constant Current Sink
Over/Under Voltage Protection Circuit
Figure 9: Over/Under Voltage Protection Circuit
Delay timer
Figure 10: Delay timer

SEMICONDUCTOR ASSEMBLY PROCESS - SHORT APPLICATION NOTE
Semiconix flip chip components are designed for dry assembly processes as well as for processes that use adhesives, fluxes etc. Dry assembly process is an assembly process that does not use additional solders, fluxes or adhesives. Thermosonic wire bonding is a dry assembly process. Semiconix Flip Chip -FC series can be also used for thermosonic wire bonding. Semiconix Gold Bump -GB series are flip chips that are thermosonically attached to a circuit. Semiconix Gold Tin -GT series are flip chips with Au/Sn, 80/20 metallized pads. GT series can be attached to circuits by bringing the die in contact with a substrate which temperature is more than 280°C. Upon cooling bellow 280C, the die is firmly welded to the substrate. Flux less dry assembly is most reliable but is also most expensive because of thick gold bumps or expensive Au/Sn process.
Semiconix -FC series is designed to be used for flip chip assembly with conductive silver epoxy. It is a simple and inexpensive process consisting of 3 steps: - transfer a thin conductive epoxy layer onto the bonding pads; -align to substrate and attach; -cure silver epoxy and inspect. Same procedure may be used also with -GB series in certain applications.
Semiconix Gold/Nickel -AN series is the most efficient wafer level chip size package W-CSP designed for mixed surface mount and flip chip applications. The assembly process is same as for packaged surface mount components. The process consist of at least 3 steps; -screen print solder paste on the printed circuit board; -flip chip, align and attach to the tacky solder paste; -dry paste, reflow at T>220°C, clean, etc.
Semiconix Flip Chip -AN series are available in many sizes with landing pads compatible with the industry standard CSP as well as surface mount packages.

STANDARD PRODUCTS ORDERING INFORMATION

VERSION SMX P/N WAFFLE PACKS QUANTITY U/P($) FILM FRAME MIN QUANTITY U/P($)
Flip chip SMS431BL-FC -WP 1000 -FF 1000
Flip chip SMS431BL-FC -WP 5000 -FF 5000
Gold Bump SMS431BL-GB -WP 1000 -FF 1000
Gold Bump SMS431BL-GB -WP 5000 -FF 5000
Gold-Tin SMS431BL-GT -WP 1000 -FF 1000
Gold-Tin SMS431BL-GT -WP 5000 -FF 5000
Gold/Nickel SMS431BL-AN -WP 1000 -FF 1000
Gold/Nickel SMS431BL-AN -WP 5000 -FF 5000

PRICES - Listed prices are only for standard products, available from stock. Inventory is periodically updated. List prices for other quantities and tolerances are available on line through Instant Quote. For standard products available from stock, there is a minimum line item order of $550.00. No rights can be derived from pricing information provided on this website. Such information is indicative only, for budgetary use only and subject to change by SEMICONIX SEMICONDUCTOR at any time and without notice.
LEAD TIMES - Typical delivery for standard products is 4-6 weeks ARO. For custom devices consult factory for an update on minim orders and lead times.
CONTINOUS SUPPLY - Semiconix guarantees continuous supply and availability of any of its standard products provided minimum order quantities are met.
CUSTOM PRODUCTS - For custom products sold as tested, bare die or known good die KGD, there will be a minimum order quantity MOQ. Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF. For special die level KGD requirements, different packaging or custom configurations, contact sales via CONTACTS page.
SAMPLES - Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.
ORDERING - Semiconix accepts only orders placed on line by registered customers. On line orders are verified, accepted and acknowledged by Semiconix sales department in writing. Accepted orders are non cancelable binding contracts.
SHIPING - Dice are 100% functional tested, visual inspected and shipped in antistatic waffle packs. For high volume and pick and place applications, dice are also shipped on film frame -FF.

INSTANT QUOTE
Semiconix P/N Quantity E-mail    

DISCLAIMER - SEMICONIX has made every effort to have this information as accurate as possible. However, no responsibility is assumed by SEMICONIX for its use, nor for any infringements of rights of third parties, which may result from its use. SEMICONIX reserves the right to revise the content or modify its product line without prior notice. SEMICONIX products are not authorized for and should not be used within support systems, which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent.

HOME PRODUCT TREE PACKAGES PDF VERSION SEARCH

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